Papers by Author: L. Storasta

Abstract: We have studied annealing of the main lifetime limiting defect Z1/2 in thick 4H-SiC epilayers by the application of carbon-implantation/annealing method. Examination of different implantation doses and annealing temperatures showed that finding the optimum conditions is crucial for obtaining carrier trap concentration below 1011 cm-3 in the whole 100 μm epilayer. The carrier lifetime increased from under 200 ns to over 1 μs at room temperature in the samples prepared by optimized carbon-implantation/annealing technique. Fabrication of pin diodes from the improved thick 4H-SiC epilayers confirmed the enhanced conductivity modulation and suitability of this technique for high-voltage bipolar SiC devices.

Abstract: A vertical hot-wall type epi-reactor that makes it possible to simultaneously achieve both a high rate of epitaxial growth and large-area uniformity at the same time has been developed. A maximum growth rate of 250 µm/h is achieved at 1650 °C. Thickness uniformity of 1.1 % and doping uniformity of 6.7 % for a 65 mm radius area are achieved while maintaining a high growth rate of 79 µm/h. We also succeeded in growing a 280 µm-thick epilayer with excellent surface morphology and long carrier lifetime of ~1 µs on average. The LTPL spectrum shows free exciton peaks as dominant, and few impurity-related or intrinsic defect related peaks are observed. The DLTS measurement for an epilayer grown at 80 µm/h shows low trap concentrations of 1.2×1012 cm-3 for Z1/2 center and 6.3×1011 cm-3 for EH6/7 center, respectively.

Abstract: Reduction in deep level defects and increase of carrier lifetime in 4H-SiC epilayer was observed after carbon ion implantation into the shallow surface layer of 250 nm and subsequent annealing above 1400 °C. The concentration of Z1/2 and EH6/7 traps was determined by deep level transient spectroscopy 4 μm below the implanted layer. After annealing, concentration of both traps decreased from 1013 cm-3 range to below the detection limit. Minority carrier lifetime almost doubled in the implanted samples compared to the unimplanted samples. We suggest that carbon interstitials from the implanted layer in-diffuse into the layer underneath during annealing and annihilate with carbon vacancies. Our results indicate that Z1/2 and EH6/7 traps are most likely carbon vacancy related.

Abstract: Synchrotron reflection X-ray topography and KOH etching were applied to investigate the effects of the ion implantation/annealing process on the existing dislocations in the 4H-SiC epilayers and second epitaxial growth on the ion implanted layer. No systematic generation of dislocations or stacking faults caused by the second epitaxial growth on the implanted layer was observed, while BPDs were confirmed to migrate in the epilayer during the implantation/annealing process. The BPDs bend markedly near the bottom of the implanted layer and tend to lie along the <1-100> (perpendicular to the off-cut direction) after the implantation/annealing process. The lattice mismatch strain created by the implantation is a possible driving force of the glide motion of the BPDs.

Abstract: A vertical hot-wall type reactor, with a unique structure designed for controlling both gas flow behavior and thermal gradient (
T/mm) on the susceptor surface, was developed. The simulation results indicate that depending on the height of the epitaxy room (h), the
T/mm can be changed from a negative to a positive value. Preliminary epitaxial growth experiments resulted in a maximum growth rate of 51 μm/h, 4-inch area uniformity of σ/mean=1.7% for growth rate and σ/mean=21.5 % for doping concentration, and Z1/2 trap concentration of 9×1012 cm-3 at a growth rate of 43 μm/h.

Abstract: We have investigated the electrically active deep level defects in p- and n-type 4H-SiC after low energy electron irradiation. Intrinsic defects were created by irradiation with 200 keV electrons, with energy sufficient to move only the carbon atoms in SiC lattice. Defect spectra were compared between the p- and n-doped samples prepared under identical irradiation conditions. We probed both conduction and valence band sides of the band-gap by using capacitance transient techniques with electrical and optical trap filling. We have found that the defect spectrum in the p-type epilayers differs significantly from the n-type. The Z1/Z2, EH1 and EH3 electron traps which are usually present in irradiated n-type material could not be detected in p-type samples. An electron trap at 1.6 eV below the conduction band edge is present in both n- and p-type samples at the same energy position and with similar concentration, therefore it is probably related to the same type of defect. We have also found a new hole trap in p-type epilayers at energy EV + 0.66 eV.

Abstract: We applied four-wave mixing (FWM) technique for investigation of high temperaturechemical vapour deposition (HTCVD) grown 4H-SiC samples with different doping levels. The determined minority electron and hole mobilities in heavily doped crystals at doping densities of 1019 cm-3 were found to be equal to 116 and 52 cm2/Vs. In semi-insulating (SI) crystals, the ambipolar diffusion coefficient Da = 2.6 − 3.3 cm2/s and carrier lifetimes of 1.5 – 2.5 ns have been measured. Irradiation of SI crystals by 6 MeV electrons resulted in essential decrease of carrier lifetime down to ~ 100 ps and clearly revealed the defect-assisted carrier generation with respect to two-photon interband transitions before irradiation.

Abstract: Recombination enhanced defect annealing of intrinsic defects in 4H-SiC, created by low energy electron irradiation, has been observed. A reduction the defect concentration at temperature lower than the normal annealing temperature of 400º C and 800°C is observed after either above bandgap laser excitation or forward biasing of a pin-diode. The presence of the defects has been studied both electrically and optically using capacitance transient spectroscopy and low temperature photoluminescence. Photoluminescence measurements show that several lines, normally detected after electron irradiation, have almost or entirely disappeared by recombination enhanced annealing at room temperature. From capacitance transient measurements, the annealing enhancement is found to be largest for the HS2 hole trap, while the EH1 and EH3 electron traps also anneal out by recombination enhanced reaction but at a lower rate.