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Articles by author: Marc Meuris

• A Study of the Influence of Typical Wet Chemical Treatments on the Germanium Wafer Surface
  Published in: Ultra Clean Processing of Silicon Surfaces VII (p27)
• A Wet Etching Technique to Reveal Threading Dislocations in Thin Germanium Layers
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p83)
• Defect Removal, Dopant Diffusion and Activation Issues in Ion-Implanted Shallow Junctions Fabricated in Crystalline Germanium Substrates
  Published in: Gettering and Defect Engineering in Semiconductor Technology XI (p691)
• Etch Rate Study of Germanium, GaAs and InGaAs: A Challenge in Semiconductor Processing
  Published in: Ultra Clean Processing of Semiconductor Surfaces IX (p203)
• Impact of Trace Metals in Litho Chemicals
  Published in: Ultra Clean Processing of Silicon Surfaces IV (p279)
• Non-Contact Post Cu CMP Cleaning Using Megasonic Energy
  Published in: Ultra Clean Processing of Silicon Surfaces V (p39)
• Ozonated DI-Water for Clean Chemical Oxide Growth
  Published in: Ultra Clean Processing of Silicon Surfaces IV (p77)
• Particle Deposition and Removal from Ge Wafers
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p173)
• Relation between Oxide-CMP Induced Defects and Post-CMP Cleaning Strategies
  Published in: Ultra Clean Processing of Silicon Surfaces IV (p173)
• Rinsing and Drying Effects on Heterogeneous Substrates
  Published in: Ultra Clean Processing of Silicon Surfaces V (p195)
• Surface Preparation Techniques for High-k Deposition on Ge Substrates
  Published in: Ultra Clean Processing of Silicon Surfaces VII (p31)
• Ultra-Thin Oxide Growth on Silicon Using Ozonated Solutions
  Published in: Ultra Clean Processing of Silicon Surfaces IV (p81)