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Articles by author: Pei Lum Tso

• A Study of the Form Error Compensation for Aspherical Lens Machining
  Published in: Advances in Abrasive Technology V (p369)
• A Study of Thermal-Chemical Polishing for CVD Diamond Thin Films
  Published in: Advances in Abrasive Technology XII (p207)
• A Study on the Dressing Rate in CMP Pad Conditioning
  Published in: Advances in Abrasive Technology VI (p377)
• Amorphous Diamond Dresser for CMP Fixed Abrasives Pad
  Published in: Advances in Abrasive Technology IX (p157)
• Analysis of Fixed Abrasive Pads with a Nano-Sized Diamond for Silicon Wafer Polishing
  Published in: Advances in Abrasive Technology XII (p410)
• Inverse Kinematics with 3-Dimensational Tool Compensation for 5-Axis Machine Center of Tilting Rotary Table
  Published in: Mechanical and Aerospace Engineering (p3525)
• Polishing Characteristics on Silicon Wafer Using Fixed Nano-Sized Abrasive Pad
  Published in: Advances in Abrasive Technology XI (p487)
• Study on Chemical Mechanical Polishing with Ultrasonic Vibration
  Published in: Advances in Abrasive Technology XIII (p311)
• Study on the CMP Pad Life with its Mechanical Properties
  Published in: Advances in Abrasive Technology XI (p481)
• Study on Thin Diamond Wire Slicing with Taguchi Method
  Published in: Progress on Advanced Manufacture for Micro/Nano Technology 2005 (p1219)
• The CMP by Polishing with GiP Dressed by BODD
  Published in: Advances in Abrasive Technology XIII (p1013)
• Thinning Silicon Wafer with Polycrystalline Diamond Tools
  Published in: Progress in Abrasive and Grinding Technology (p157)