Papers by Author: Robert J. Falster

Abstract: Transient and quasi-steady-state photoconductance methods were used to measure minority carrier lifetime in p-type Czochralski silicon processed in very clean conditions to contain oxide precipitates. Precipitation treatments were varied to produce a matrix of samples, which were then characterised by chemical etching and transmission electron microscopy to determine the density and morphology of the precipitates. The lifetime component associated with the precipitates was isolated by preventing or factoring out the effects of other known recombination mechanisms. The lifetime component due to unstrained precipitates could be extremely high (up to ~4.5ms). Recombination at unstrained precipitates was found to be weak, with a capture coefficient of ~8 x 10^-8cm³s^-1 at an injection level equal to half the doping level. Strained precipitates and defects associated with them (dislocations and stacking faults) act as much stronger recombination centres with a capture coefficient of ~3 x 10^-6cm³s^-1 at the same level of injection. The lifetime associated with strained precipitates increases with temperature with a ~0.18eV activation energy over the room temperature to 140°C range. The shape of the injection level dependence of lifetime was similar for all the specimens studied, with the magnitude of the lifetime being dependent on the precipitate density, strain state and temperature, but independent of precipitate size.

Abstract: Out-diffusion nitrogen profiles measured by SIMS after annealing at 850 and 800oC, have a peculiar minimum at a depth of about 5 m. The profiles are well reproduced by simulations assuming that there is a considerable fraction of nitrogen stored in substitutional clusters VN4. Upon annealing, these clusters lose nitrogen and convert into a stable high-temperature form VN1. This reaction involves a preliminary attachment of a fast-diffusing interstitial trimer, N3. Accordingly, the conversion occurs only in the bulk but not at the surface (due to out-diffusion loss of N3), and the substitutional component decreases from the surface towards the bulk. By fitting the profiles, the two basic parameters of the N2/N1 transport are deduced: P = D1K1/2 (a combination of the monomeric diffusivity D1 and the dissociation constant of dimers, K), and the dissociation time of dimers. With these data, D1(T) and K(T) are specified.

Abstract: The concept of fully encapsulated, semi-insulating silicon (SI-Si), Czochralski-silicon-on-insulator (CZ-SOI) substrates for silicon microwave devices is presented. Experimental results show that, using gold as a compensating impurity, a Si resistivity of order 400 kΩcm can be achieved at room temperature using lightly phosphorus doped substrates. This compares favourably with the maximum of ~180kΩcm previously achieved using lightly boron doped wafers and is due to a small asymmetry of the position of the two gold energy levels introduced into the band gap. Measurements of the temperature dependence of the resistivity of the semi-insulating material show that a resistivity ~5kΩcm can be achieved at 100°C. Thus the substrates are suitable for microwave devices working at normal operating temperatures and should allow Si to be used for much higher frequency microwave applications than currently possible.

Abstract: The generation of Thermal Donors in Si is a nucleation process controlled by several mobile On clusters. The rate-limiting transitions are found to be O1  O2 and O4  O5. The individual transition rates G12 and G45, and also G23 and G34 are deduced from the experimental data. From the transient variation of the generation rate G(t), the equilibrium concentration of the dimers is found, and with it the dimeric diffusivity is also defined. In samples pre-treated at high T, the G(t) dependence has a maximum, due to quenched-in fast-diffusing oxygen monomers (FDMs). The concentration and diffusivity of FDMs were determined.

Abstract: Kinetics of oxide layer dissolution and atomic structure of Si-Si interface in Si wafer bonded structures have been investigated by transmission electron microscopy. Samples of Si(001)/SiO2/Si(001) and Si(110)/SiO2/Si(001) structures were fabricated by direct hydrophilic wafer bonding of 200 mm wafers followed by high temperature annealing. It is found that the decomposition rate of oxide layer and formation of Si-Si bonded interface depends very much on lattice mismatch and twist angle.

Abstract: The use of Rapid Thermal Processing to install lattice vacancy profiles into silicon wafers for the purpose of forming a template for the nucleation and ideal control of oxygen precipitation has become an important materials engineering tool for the microelectronics industry. This paper reviews the principles of the technique and the precise materials/defect engineering that it engenders. It furthermore discusses what has been learned regarding the elusive properties of the intrinsic point defects in silicon through studies of the distributions of vacancies created by use of the technique. Also discussed are recent discoveries about the critical role of the other intrinsic point defect, the self-interstitial and the development of oxygen precipitates and their distributions post-nucleation and the critical importance of what has become to be called the “ninja transformation” in the switching-on of gettering efficiency of oxygen precipitate systems.

Abstract: The time dependence of thermal donor (TD) concentration, N(t), during annealing at 450oC was measured in samples cut from a single slab of silicon containing bands of grown-in microdefects of different types. An enormous impact of the microdefect type on the kinetic curve was observed. Samples from the interstitial region showed simple linear rise in N(t). The samples from an inner part of the vacancy region showed a complicated oscillating variation with an abrupt disappearance of the TDs at some moment followed by an immediate restoration of a linear rise. In samples from the marginal H-band of the vacancy region, an initial anneal does not produce TDs. However if this anneal was followed by a quench, subsequent anneals produce a linear rise in N(t). On the other hand, if the sample was slowly cooled, the subsequent production of TDs remained almost negligible. These observed peculiarities are accounted for by enhanced TD growth in the presence of self-interstitials (I) - due to IO species serving as vehicles for oxygen transport.

Abstract: Nitrogen in silicon is known to affect dramatically the properties of voids. A plausible mechanism could be vacancy trapping by nitrogen interstitial species, mostly by the minor monomeric species (N1) with only a negligible contribution of the major dimeric species (N2). However, a more careful analysis of the published data shows that in Czochralski silicon no vacancy trapping occurs at the void formation stage (around 1100oC). The implication is that the trapping reaction, V + N1, although favoured thermodynamically, is of a negligible rate. Therefore, the nitrogen effect on voids in Czochralski Si is entirely due to nitrogen adsorption at the void surface. Quite a different mechanism operates in Float-Zoned crystals where voids are formed at lower T. Here vacancy trapping by N2 seems to be responsible for void suppression.

Abstract: Dislocation locking by nitrogen impurities has been investigated in float-zone silicon with nitrogen concentrations of 2.2 x 1015cm-3 and 3 x 1014cm-3. The stress required to unlock dislocations pinned by nitrogen impurities was measured as a function of annealing time (0 to 2500 hours) and temperature (550 to 830°C). For all conditions investigated the locking effect was found to increase linearly with annealing time before saturating. It is assumed that the rate of increase of unlocking stress with annealing time is a measure of transport of nitrogen to the dislocation core. This rate of increase was found to depend linearly on nitrogen concentration, which is consistent with transport by a dimeric species, whose activation energy for diffusion is approximately 1.4eV. The saturation unlocking stress has been found to be dependent on the nitrogen concentration. Additionally, the temperature dependence of the stress required to move dislocations immobilised by nitrogen impurities has been studied. By assuming a value for the binding energy of the nitrogen to the dislocation, the density of the locking species at the dislocation core has been calculated.

Abstract: This paper presents a qualitative description and quantitative model of the technologically important problem of the transition from ineffective to effective internal gettering (IG) states in CZ silicon wafers as the precipitation of oxygen proceeds at high temperatures. Of central importance to the problem is a morphological transformation of growing oxide preciptitates from an initial strain free to a strained platelet state. The transition to effective IG occurs when approximately 107 cm-3 precipitate sites are transformed into the strained state. The transformation rates as a function of oxygen concentration and precipitate site density, deduced from etching and TEM, are presented. A model for the morphological transformation to the strained state is developed and with it a model for the annealing criteria for the threshold for effective gettering.