HOME
CONTACT
My eBook
Username:
Password:
FULLTEXT SEARCH
NEW:
Advanced Search
MSF
>
Materials Science Forum
KEM
>
Key Engineering Materials
SSP
>
Solid State Phenomena
DDF
>
Defect and Diffusion Forum
AMM
>
Applied Mechanics and Materials
AMR
>
Advanced Materials Research
AST
>
Advances in Science and Technology
JNanoR
>
Journal of Nano Research
JBBTE
>
Journal of Biomimetics, Biomaterials, and Tissue Engineering
JMNM
>
Journal of Metastable and Nanocrystalline Materials
JERA
>
International Journal of Engineering Research in Africa
AEF
>
Advanced Engineering Forum
NH
>
Nano Hybrids
> @scientific.net
CONFERENCE
6/16/2013 - 6/19/2013
The 7th International conference on Physical and Numerical Simulation of Materials Processing
5/16/2013 - 5/19/2013
2nd International Congress on Advanced Materials
4/13/2013 - 4/14/2013
2013 2nd lnternational Conference on lntclligent Materials, Applied Mechanics and Design Science (IMAMD 2013)
more...
Articles by author: Soon Bok Lee
19 papers on 2 pages:
1
[2]
[next]
A Comparative Study of The Fatigue Behavior of SnAgCu and SnPb Solder Joints
Published in:
Advances in Fracture and Strength
(p831)
A Novel Description of Thermomechanical Behavior Using a Rheological Model
Published in:
Fracture and Strength of Solids VI
(p205)
Calculation of Local Stress-Strain Behavior at Notches for Non-Masing Material under Cyclic Loading
Published in:
Advances in Fracture and Strength
(p59)
Calculation of Stress Intensity Factor Using Weight Function Method for a Patched Crack
Published in:
Fracture and Strength of Solids IV
(p103)
Chip Warpage Damage Model for ACA Film Type Electronic Packages
Published in:
Advances in Fracture and Strength
(p887)
Definition of Damage Parameter in Low-Cycle Fatigue of Gray Cast Iron
Published in:
The Mechanical Behavior of Materials X
(p367)
Dynamic Strain Aging during Low Cycle Fatigue Deformation in Prior Cold Worked 316L Stainless Steel
Published in:
Advances in Fracture and Failure Prevention
(p1129)
Effect of High Glass Transition Temperature on Reliability of Non-Conductive Film (NCF)
Published in:
Experimental Mechanics in Nano and Biotechnology
(p517)
Effects of Microstructure on Material Behaviors of Solder Alloys
Published in:
Advances in Fracture and Strength
(p825)
Experimental Investigation on the Proper Fatigue Parameter of Cyclically Non-Stabilized Materials
Published in:
Advances in Fracture and Strength
(p2477)
Fundamentals of Mode III Fracture: A Discrete Dislocation Simulation Approach
Published in:
Fracture and Strength of Solids III
(p135)
Growth of Epitaxial Cubic SiC Thin Films Using Single Source Precursors
Published in:
Silicon Carbide, III-Nitrides and Related Materials
(p187)
Inverse Method to Determine Mechanical Properties of Thin Film by Nanoindentation and Finite Element Analysis
Published in:
Experimental Mechanics in Nano and Biotechnology
(p219)
Low Cycle Fatigue Behavior of 429EM Ferritic Stainless Steel at Elevated Temperatures
Published in:
Advances in Fracture and Failure Prevention
(p1135)
Measurement of Mechanical Properties of Electroplated Nickel Thin Film
Published in:
Advances in Fracture and Failure Prevention
(p417)
Username:
Password: