Papers by Author: Tangali S. Sudarshan

Abstract: A method was developed in our laboratory to grow low basal plane dislocation (BPD) density and BPD-free SiC epilayers. The key approach is to subject the SiC substrates to defect preferential etching, followed by conventional epitaxial growth. It was found that the creation of BPD etch pits on the substrates can greatly enhance the conversion of BPDs to threading edge dislocations (TEDs) during epitaxy, and thus low BPD density and BPD-free SiC epilayers are obtained. The reason why BPD etch pits can promote the above conversion is discussed. The SiC epilayer growth by this method is very promising in overcoming forward voltage drop degradation of SiC PiN diodes.

Abstract: Thick layers have been grown on (1120) and (1 1 00)6H-SiC substrates. The thicknesses are up to 90 #m obtained with growth rate of 180 #m/h. Even in such thick layers the surfaces are smooth and only disturbed by polishing scratches. The surfaces contain steps which facilitate reproduction of the substrate polytype.

Abstract: More than fifty years ago Frank proposed that a dislocation with a Burgers vector larger than a critical value would have an open core. Since then, there has been controversy as to whether micropipes in SiC are examples of open core screw dislocations. In this work open core dislocations in 4H-SiC material are investigated by AFM. The results are interpreted on the basis of Frank’s theory and the surface energy of SiC is estimated from the critical value of Burgers vector. Finally, the extracted surface energy is compared with the results of other research.

Abstract: In this work, we investigated the effect of crystal defects on reverse I-V characteristics of avalanche photodiodes (APDs) using electron-beam induced current (EBIC) mode of SEM. Two types of SiC APD structures (I and II) were fabricated using 2 inch p-doped substrates with n-doped epilayers and 3 inch n-doped substrates with p- and n- epilayers. Areas of the formed diodes were approximately 1 mm2. The devices without any kind of electrically active 3-D structural defects demonstrated breakdown voltages close to theoretical values, ~500 V for the APD Type I and ~1200 V for Type II APD. Stability of Type I devices was tested by applying a short pulse of high voltage (~800 V). EBIC images, taken prior to and after the failure test, showed new defects in the dislocation free area, which, presumably, were caused by thermal breakdown.

Abstract: Dislocations were tracked from 4H-SiC epilayer to the substrate by a new method based on combination of molten KOH etching and Reactive Ion Etching. It was found that basal plane dislocations (BPDs) with dislocation lines parallel (or approximately parallel) to the off-cut direction might propagate as BPDs into the epilayer, while those with dislocation lines forming large angles (>10º) with the off-cut direction will get converted to threading edge dislocations (TEDs). A model is proposed to explain the observations.

Abstract: The nucleation sites of stacking faults (SFs) during forward current stress operation of 4H-SiC PiN diodes were investigated by the electron beam induced current (EBIC) mode of scanning electron microscopy (SEM), and the primary SF nucleation sites were found to be basal plane dislocations (BPDs). Damage created on the diode surface also acts as SF nucleation sites. By using a novel BPD-free SiC epilayer, and avoiding surface damage, PiN diodes were fabricated which did not exhibit SF formation under current stressing at 200A/cm2 for 3 hours.

Abstract: In this paper the electrical activity of stacking faults and that of their bounding partial dislocations in degraded PiN diodes has been investigated by the technique of electron beam induced current (EBIC). The recombination behavior of C- and Si-core dislocations is discussed. It is proposed that nonradiative recombination significantly exceeds radiative recombination on both the C- and Si-core partial dislocations. At the same time, predominantly radiative recombination takes place in the faulted planes that presumably act as quantum wells.

Abstract: The ability to set and accurately control the desired growth conditions is crucial in order to attain high quality bulk growth of Silicon Carbide (SiC), especially when the ingot size is large (> 2” in diameter by > 2” long). However, these two aspects of SiC PVT (Physical Vapor Transport) growth technology are severely limited in “conventional” SiC PVT growth reactors with single cylindrical heaters. To overcome such shortcomings, an “alternative” furnace design with two plane resistive heaters is proposed. In order to verify benefits of this design, numerical modeling and comparative procedures have been employed. Detailed comparative analysis revealed two fundamental disadvantages of the conventional furnace design, attributed to (a) – significantly higher in magnitude and spatially nonuniform distribution of the thermal stress that consequently deteriorates structural quality of the growing SiC boule, and (b) – inability to grow long (> 2”) monocrystalline ingots of SiC. Furthermore, the potential of the alternative furnace design to overcome fundamental limitations of the conventional design is also analyzed, with particular attention being paid to the processes of source material recrystallization.

Abstract: The degradation of diffused SiC PIN diodes during forward-biased operation was studied by first fabricating PIN diodes by diffusion of aluminum or boron into 4H-SiC substrates with n-type 10-15 µm thick epilayers doped by nitrogen up to 5x1015cm-3. The formed diodes were subjected to degradation testing under an applied current density of 200A/cm2 at room temperature. The majority of the Al diffused diodes demonstrated a voltage drift, ΔVf, of more than 2 V, while B-doped diodes showed no significant change in forward voltage. The EBIC mode of SEM was employed to monitor nucleation and expansion of stacking faults.

Abstract: An effect of electron beam annealing (EBA) on both surface morphology and characteristics of test Ti/n-6H-SiC contacts was investigated. It was found that the mean roughness of the n-6H-SiC surface decreased from 3.43 nm to 1.35 nm and the surface sheet resistance increased from 3.1 to 4.0 Ω/sq after EBA. The Ti/n-6H-SiC contacts formed on substrates after EBA exhibited ohmic properties, while the same contacts formed on the un-annealed samples were Schottky contacts with the barrier height of 0.63 eV and ideality factor of 1.92.