HOME CONTACT My eBook

Username: Password:

> @scientific.net

Articles by author: Y.B. Tian

• A Novel Single Step Thinning Process for Extremely Thin Si Wafers
  Published in: Advances in Abrasive Technology XII (p434)
• Effect of Wheel Additive On Chemo-Mechanical Grinding (CMG) of Single Crystal Si Wafer
  Published in: Advances in Precision Engineering (p106)
• Effects of Sodium Carbonate and Ceria Concentration on Chemo-Mechanical Grinding of Single Crystal Si Wafer
  Published in: Advances in Abrasive Technology XII (p428)
• Material Removal Mechanism of Chemo-Mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasive Grinding Wheel (SAGW)
  Published in: Advances in Abrasive Technology XI (p459)
• Study on Improvement of Material Removal Rate in Chemo-Mechanical Grinding (CMG) of Si Wafer
  Published in: Advances in Abrasive Technology XI (p13)