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Articles by author: Young Eui Shin

• A Numerical Study on Nonequilibrium Heat Transfer and Crater Formation in Thin Metal Films Irradiated by Femtosecond Pulse Laser
  Published in: Advanced Welding and Micro Joining / Packaging for the 21st Century (p143)
• An Investigation on Wetting Characteristics of Solder Particle for Solderable Electrically Conductive Adhesives (ECAs)
  Published in: Advanced Welding and Micro Joining / Packaging for the 21st Century (p217)
• Board-Level Reliability of Pb-Free Surface Mounted Assemblies during Thermal Shock Testing
  Published in: THERMEC 2006 Supplement (p633)
• Effect of Viscosity of Liquid Resin on Resin Self-Alignment Capability
  Published in: Eco-Materials Processing & Design IV (p12)
• Reliability Assessment of Lead Free Soldered PWBs
  Published in: Advanced Welding and Micro Joining / Packaging for the 21st Century (p259)
• Reliability Evaluation of QFP Solder Joint Using Sn-8Zn-3Bi Solder Paste during the Thermal Shock Test
  Published in: Advanced Welding and Micro Joining / Packaging for the 21st Century (p247)
• Selection of Proper Fatigue Model for Flip Chip Package Reliability
  Published in: New Frontiers of Processing and Engineering in Advanced Materials (p393)
• Weldability Studies on the Replacement Repair Welded Joints of a Damaged Steel Bridge
  Published in: Advanced Welding and Micro Joining / Packaging for the 21st Century (p655)