Papers by Keyword: Bipolar Junction Transistor (BJT)

Abstract: The last three years have seen a rapid growth of 600 V and 1200 V SiC Schottky diodes primarily in the Power Factor Correction (PFC) circuits. The next logical step is introduction of a SiC MOSFET to not only further improve the power density and efficiency of the PFC circuits but also to enable the entry of all SiC power modules in Pulse Width Modulated (PWM) based power converters such as motor control in 600-1200 V range. The combination of SiC MOSFET and Schottky diodes will offer 60-80% lower losses in most low voltage applications at normal operating temperatures (< 200°C) where no significant improvements in packaging are required. This will cover most commercial applications with the exception of those having to function under extreme environment (>200°C) such as applications in automotive, aerospace and oil/gas exploration. For these high temperature applications, a case can be made for 600 - 2000 V Bipolar Junction Transistors (BJTs) and PiN diodes provided we do our homework on high temperature packaging. A number of interesting device related problems persist in bipolar devices such as forward voltage increase in PiN diodes and current gain degradation in BJTs. For very high voltage (>10 kV) applications such as those found in utilities (Transmission and Distribution), Large Drives and Traction, a case can be made for >10 kV PiN diodes, IGBTs, Thyristors and GTOs. While IGBTs will be restricted to <200°C junction temperature, the PiN diodes, Thyristors and GTOs may be operated at >250°C junction temperature provided that the high temperature, high voltage packaging issues are also addressed. Significant progress has been made in the development of the p-channel IGBTs and GTOs. The main issues seem to be the VF degradation due to stacking fault formation and improvement of minority carrier life-time.

Abstract: The effect of the different types of passivation layers on the current gain of SiC BJTs has been investigated. Measurements have been compared for BJTs passivated with thermal SiO2, plasma deposited (PECVD) SiO2 and BJTs without passivation. The maximum DC current gain of BJTs with thermal SiO2 was about 62 at IC=20 mA and Vce=40 V. On the other hand, the BJTs with a passivation by PECVD SiO2 had a DC current gain of only 25. The surface recombination current was extracted from measurements with BJTs of different emitter widths. The surface recombination current of BJTs with a thermally grown oxide was about 25 % lower than unpassivated BJTs and 65 % lower than that of PECVD passivated BJTs.

Abstract: Characterization of n+-GaN/p−-SiC and n+-GaN/p+-SiC heterojunctions as well as fabrication of GaN/SiC heterojunction bipolar transistors (HBTs) using these heterojunctions is presented. The electroluminescence spectrum from n+-GaN/p+-SiC heterojunction diodes under forward bias clearly indicates electron injection from n+-GaN into p+-SiC. HBTs consisting of n+-GaN emitter /p+-SiC base/n−-SiC collector/n+-SiC substrate have been fabricated. Although clear common-base properties were obtained, the current gain was very low (10-4). SiC homojunction bipolar junction transistors (BJT) using the same base-collector junction exhibited a current gain value of 0.5, suggesting the low current gain of GaN/SiC HBTs originates from low emitter efficiency.

Abstract: For the first time, 4H-SiC RF bipolar junction transistors have been used to produce an output power in excess of 2.1 kW at 425 MHz. For an input pulse width of 2 μs and 1% duty cycle, the power gain at peak output power is 6.3 dB with the collector efficiency and power added efficiency [PAE] being 45% and 35%, respectively, at a collector supply voltage of 75 V in a class C configuration. The package consists of 24 cells (2 chips) having an emitter periphery of approximately 1 inch per cell. Each cell produced a DC current gain (β) of 15 and a common emitter breakdown voltage (BVCEO) greater than 250 V. A peak output power of 87 W per cell was obtained at 425 MHz, as compared to the earlier report of 50 W per cell [1, 2] by using a shorter pulse width and duty cycle.

Abstract: SiC BJTs show instability in the I-V characteristics after as little as 15 minutes of operation. The current gain reduces, the on-resistance in saturation increases, and the slope of the output characteristics in the active region increases. This degradation in the I-V characteristics continues with many hours of operation. It is speculated that this phenomenon is caused by the growth of stacking faults from certain basal plane dislocations within the base layer of the SiC BJT. Stacking fault growth within the base layer is observed by light emission imaging. The energy for this expansion of the stacking fault comes from the electron-hole recombination in the forward biased base-emitter junction. This results in reduction of the effective minority carrier lifetime, increasing the electron-hole recombination in the base in the immediate vicinity of the stacking fault, leading to a reduction in the current gain. It should be noted that this explanation is only a suggestion with no conclusive proof at this stage.

Abstract: This paper reports on a 400 watt boost converter using a SiC BJT and a SiC MOSFET as the switch and a 6 Amp and a 50 Amp SiC Schottky diode as the output rectifier. The converter was operated at 100 kHz with an input voltage of 200 volts DC and an output voltage of 400 volts DC. The efficiency was tested with an output loaded from 50 watts to 400 watts at baseplate temperatures of 25°C, 100°C, 150°C and 200°C. The results show the converter in all cases capable of operating at temperatures beyond the range possible with silicon power devices. While the converter efficiency was excellent in all cases, the SiC MOSFET and 6 Amp Schottky diode had the highest efficiency. Since the losses in a boost converter are dominated by the switching losses and the switching losses of the SiC devices are unaffected by temperature, the efficiency of the converter was effectively unchanged as a function of temperature.

Abstract: For 1-kV, 30-A 4H-SiC epitaxial emitter npn bipolar junction transistors, the dependence of the common-emitter current gain β on the collector current IC were measured at elevated temperatures. The collector-emitter voltage was fixed (at 100 V voltage) to provide an active operation mode at all collector currents varying in a wide range from 150 mA to 40 A (current densities 24 - 6350 A/cm2). The maximum room temperature current gain was measured to be βmax = 40 (IC = 7 A) while βmax = 32 (IC = 10 A) at 250oC. The β-IC dependences were simulated using a model which takes into account the main processes affecting the current gain. Minority carrier lifetimes and surface recombination velocity were obtained by means of those considerations.

Abstract: This paper summarizes the recent demonstration of 3200 V, 10 A BJT devices with a high common emitter current gain of 44 in the linear region, and a specific on-resistance of 8.1 mΩ- cm2 (10 A at 0.90 V with a base current of 350 mA and an active area of 0.09 cm2). The onresistance increases to 40 mΩ-cm2 at 350°C, while the DC current gain decreases to 30. A sharp avalanche behavior was observed with a leakage current of 10 μA at a collector voltage of 3.2 kV.

Abstract: The performance prospects for 4H-SiC Bipolar Junction Transistors (BJTs) and Insulated Gate Bipolar Transistors (IGBTs) are theoretically evaluated. The total power dissipated (Ptotal) for both devices is calculated as a function of lifetime in the drift region and blocking voltage and used as a figure of merit to compare and contrast the effectiveness of different semiconductor materials for bipolar device applications. Assuming a maximum of 300W/cm2 for the total permissible power dissipation due to heat sink constraints we estimate an upper limit of 5kV for SiC BJT operation.

Abstract: We evaluate the performance capabilities and limitations of high voltage 4H-SiC based Bipolar Junction Transistors (BJTs). Experimental forward characteristics of a 4kV BJT are studied and simulations are employed to determine the factors behind the higher than expected specific onresistance (Ron,sp) for the device. The impact of material (minority carrier lifetimes), processing (surface recombination velocity) and design (p contact spacing from the emitter mesa) parameters on the forward active performance of this device are discussed and ways to lower Ron,sp, below the unipolar level, and increase the gain (β) are examined.