Papers by Keyword: Hot-Wall CVD

Abstract: 70-um thick homoepitaxial layers with very low defect density were grown on 6-inch 4° off-axis wafers using hot-wall chemical vapor deposition (CVD). Process optimization resulted in reduction of the density of triangular defects from 1.01 cm^-2 to 0.14 cm^-2. The treatment of wafer (CMP or selection) was essential. The in-situ etch process was optimized prior to the epitaxial growth. Junction Barrier Schottky diodes fabricated on the epitaxial films presented a typical I–V characteristic and a block voltage of 6500 V.

Abstract: The effect of H₂ carrier gas on the growth rate during the trench filling using CVD epitaxial growth was investigated in a wide pressure range (10∼38 kPa). It is found that, in the entire pressure range, reducing H₂ flow rate can increase the filling rate (the growth rate inside trench) and the filling efficiency (the thickness ratio between epilayer on trench bottom and mesa top), which means a high productivity and a low risk of void defects. The filling rate and efficiency of ∼1.5 μm/h and ∼18 respectively was achieved at 38 kPa.

Abstract: By using hot-wall CVD method, thick heavily Al-doped 4H-SiC epilayers (~90 μm) were grown on 3-inches 4H-SiC wafers. Around the solubility limit, the incorporation behaviors of Al into 4H-SiC were investigated by varying the growth conditions. Among the samples having smooth surfaces, the maximum Al dopants concentration of 3.5×10²⁰ cm^-3 and the minimum resistivity of 16.5 mΩcm were achieved. The results of Hall-effect measurement demonstrate that, along with the increase of Al doping level, the activation ratio of Al dopants gradually increases from several percent up to 100% where the Al dopants concentration is 1.5×10²⁰ cm^-3.

Abstract: Focusing on the change in aluminium-related photoluminescence lines in 4H-SiC versus doping concentration, we have used a combination of LTPL (Low Temperature PhotoLuminescence) and secondary ion mass spectrometry measurements to set new calibration curves. In this way, one can probe the change in aluminum concentration in the range 10¹⁷ to 10¹⁹ cm^-3. When applied to LTPL maps collected on full 3-inch wafers, we show that such abacuses constitute a powerful tool to control efficiently the doping level of as-grown p⁺ (emitters) and p⁺⁺ (contact) layers for power device applications.

Abstract: Nitrogen doped 4H-SiC epitaxial layers grown by hot-wall chemical vapor deposition were investigated by deep level transient spectroscopy after irradiation with 6 MeV electrons or 1.6 MeV protons. The influence of silane and propane flows used during the epilayers growth on the behaviour of radiation induced EH6,7 levels is studied. Samples grown under different conditions were investigated: 1 sample grown in steps of different C/Si ratio obtained by changing the propane flow only; 1 sample grown in steps of different C/Si ratio obtained by changing the silane flow only; 2 samples grown with a C/Si ratio of 1.5 but with different flows of propane and silane. These investigations revealed that the low thermal stability of EH6,7 (the defects anneal out at temperatures as low as 750K) is due to the magnitude of silane flow used during the growth irrespective of the C/Si ratio. A possible structure of the EH6,7 defect is discussed.

Abstract: Single-crystalline 3C-SiC epitaxial layers were grown on on-axis Si (001) substrates by low-pressure hot-wall chemical vapour deposition. Aluminium from a trimethylaluminium (TMA) source was used for p-type doping. The atomic Al and carrier concentrations in the layers were determined as a function of the partial pressure of the TMA source gas. Secondary ion mass spectroscopy (SIMS), Hall-effect measurements at room temperature and four-point electrical resistivity method were applied to measure the atomic and electrically active Al concentrations. The crystalline perfection of the layers was characterized by high-resolution x-ray diffraction (HRXRD). At TMA-partial pressures ranging from 510-7 mbar up to 1.510-4 mbar corresponding aluminium concentrations from 21015 cm-3 up to 1.31019 cm-3 were measured in the epitaxial layers. On increasing the Al concentration from 1x1017 cm-3 to 1x1019 cm-3 the layer electrical resistivity decreases from 17 cm to 0.8 cm, while no influence on the crystalline quality of the layers was observed. The average full width at half maximum (FWHM) of the rocking curve for a 5µm thick 3C-SiC layer is about 500 arcsec. With increasing layer thickness (up to 16 µm) the FWHM of the rocking curve decreases to about 300 arcsec.

Abstract: Homoepitaxial growth has been performed on Si-face nominally on-axis 4H-SiC substrates. Special attention was paid to the surface preparation before starting the growth. Si-face polished surfaces were studied after etching under C-rich, Si-rich and under pure hydrogen ambient conditions. In-situ surface preparation, starting growth parameters and growth temperature are found to play a vital role to maintain the polytype stability in the epilayer. High quality epilayers with 100% 4H-SiC were obtained on full 2” wafer. Complete PiN structure was grown and more than 70% of the diodes showed a stable behavior and the forward voltage drift was less than 0.1 V. Also, a comparison of the electroluminescence images of diodes before and after heavy injection of 125 A/cm2 for 30 min did not show any sign of stacking fault formation in the device active region.

Abstract: In this paper we present results on the growth of low-doped thick epitaxial layers on 4° off-oriented 4H-SiC using a commercially available hot-wall multi-wafer CVD system. For the first time we show results of a low-doped full-loaded 73” run on 4° off-oriented substrates with a layer thickness of more than 70 µm. The target doping concentration of 1.2×1015 cm-3 is suitable for blocking voltages > 6 kV. Results on doping, thickness and wafer-to-wafer homogeneities are shown. The surface quality of the grown layers was characterized by AFM. The density of different types of dislocations was determined by Defect Selective Etching.

Abstract: 3C-SiC epitaxial layers were grown on on-axis Si (001) substrates by low-pressure hot-wall chemical vapour deposition. Depending on the growth parameters, the residual strain in the 3C-SiC layer was seen to be tensile or compressive. In this work, the influence of parameters, such as growth temperature and C/Si ratio in the vapour phase, on residual strain and macroscopic layer bow is investigated. We found that the wafer bow changes from convex, at a deposition temperature of 1270° C, to concave at 1370° C. High resolution x-ray diffraction data indicate that the crystal-line perfection of the layers is lower for decreasing deposition temperature and increasing compres-sive strain. No remarkable influence of the C/Si ratio in the gaseous atmosphere on the FWHM of the rocking curve was observed.

Abstract: Homoepitaxial growth of 4H-SiC epilayer by hot-wall chemical vapor deposition using bis-trimethylsilylmethane (BTMSM, C7H20Si2) precursor was investigated. The growth rate of 4H-SiC was investigated as a function of the growth temperature and source flow rate. The FWHM values of epilayers as the growth temperature and source flow rate also investigated. The growth rate of 4H-SiC epilayer grown by hot-wall CVD was 3.0 μm/h and the background doping level of 4H-SiC epilayer was mid 1015/cm3.