Papers by Keyword: Sublimation Growth

Abstract: A set of single crystal growth experiments was performed in the new resistively heated two-heater furnace, which plays the role of an induction furnace with a moving coil. In this new experimental setup we are able to control the shape of the crystallization front, from flat to extremely convex. The positive results of the experimental tests differ significantly from prior discouraging interpretation of computational modeling results obtained by a commonly used software, previously presented in the literature. The essence of a new regulation of the temperature field during the crystal growth is a displacement of the maximum of the temperature field, which at the beginning of the growth is located close to the seed and it moves towards the source material as the crystal length increases. In this way, the crystallization front is heated with a similar intensity regardless the increasing crystal length.

Abstract: II-VI is developing large-diameter SiC crystals to be used as lattice-matched, high thermal conductivity substrates for new generation GaN-based and SiC-based semiconductor devices. Large-diameter 6H SiC single crystals are grown at II-VI using our Advanced PVT sublimation growth process. Stable SI properties are achieved by compensation with vanadium, which results in high and spatially uniform resistivity, on the order of 1011 Ohm-cm. The quality of the presently grown 100 mm 6H SI substrates has been dramatically improved [1], and they are free of edge defects. Micropipe density in the 100 mm 6H SI substrates ranges from 2 to 8 cm-2 and dislocation density from 3·104 to 6·104 cm-2. X-ray rocking curves measured on as-sawn 100 mm 6H wafers showed edge-to-edge lattice curvature () between 0.1° and 0.3° and FWHM of the rocking curve between 50 and 100 arc-seconds

Abstract: We carried out investigations to elucidate the reasons for polytype changes in 4H. The aim was to sustain polytype stability throughout the entire process. The investigations were accompanied by studies on the formation of basal plane dislocations and their role as source for stacking faults. Several methods for the evaluation of material properties were applied to determine quality most precisely, e.g. KOH-defect-etching, optical microscopy, electron microscopy and X-ray-diffraction. We found out that several influences in growth conditions have to be controlled in a proper manner to achieve defect reduction. Based on these investigations we were able to improve our process and the crystal quality significantly. Best values for 3” 4H wafers show that EPD = 5x103 cm-2 , MPD < 0.1 cm-2 and FWHM-values < 15 arcsec can be achieved.

Abstract: In this study, we report defect analysis in 4H-SiC crystals of high nitrogen doping grown by sublimation method, and we discuss key points for defect restraint. The growth was performed in two kinds of growth directions; c-axis and a-axis. In the c-axis grown crystal with carrier density greater than 1×10-19cm-3, defect propagation was confirmed in the vertical direction for a growth direction affected by the doping by x-ray topography. This phenomenon was not observed in the a-axis grown crystals. In sublimation growth, the quantity of impurities tends to increase as growth rate decreases. Therefore, in the c-axis growth of doped 4H-SiC bulk crystals, we have to be careful so that dopant does not increase too much without intention in grown layers with lower growth rate, for example at the beginning and end of the growth.

Abstract: We report on growth of 3C-SiC by sublimation process in vacuum with the aim to ultimately select conditions for single polytype growth of bulk crystals. The 3C polytype occurrence, growth mechanism and structure evolution have been in the focus of the study. To gain understanding of the initial formation of the cubic polytype, growth was performed on various substrates, such as 6H- and 4H-SiC (on-axis and vicinal), as well as freestanding 3C-SiC wafers. The growth configuration used allowed a high growth rate, e.g. up to 200 (m/h, respectively very thick layers. The grown material was studied by means of optical microscopy, AFM and HRTEM. 6H-SiC (0001) Si-face substrates may be a good choice if the 3C nucleation is well controlled, which can be achieved by selecting the initial temperature ramp up and substrate orientation. These growth conditions limit the number of nucleation centers and decrease the defective boundaries.

Abstract: We have studied the impact of the chemical nature of additional gases fed into the modified physical vapor transport (M-PVT) growth cell. In particular experiments were carried out using helium, argon, nitrogen and propane in the growth setup. Numerical modeling was used to address the underlying physical and chemical effects that impact the global temperature field. It is found that chemical decomposition of complex gases plays a secondary role as heat source or sink. However, temperature variations related to varying gas compositions fed to the systems are primarily induced by changes of the graphite foam isolation properties.

Abstract: Over the past year, II-VI has transitioned from 2” to 3” commercial SiC substrates. Large-diameter semi-insulating 6H-SiC and n-type 4H-SiC single crystals are grown using the Advanced PVT growth process. Expansion of boule diameter from 2 to 3 and up to 4.25 inches has been carried out using a specially designed growth technique. Stable semi-insulating properties in 6H-SiC are achieved by precise vanadium compensation. The technique of compensation is optimized to produce a controlled and spatially uniform distribution of vanadium and high and spatially uniform electrical resistivity reaching 10 10 – 1011
·cm. N-type 3-inch 4H-SiC crystals are grown using doping with nitrogen, and 3-inch 4H-SiC substrates show uniform resistivity of about 0.018
·cm. The best quality semiinsulating (SI) 3” 6H-SiC substrates demonstrate micropipe density of 3 cm-2, and n-type 3” 4H-SiC substrates - about 1 cm-2. X-ray rocking curve topography of the produced 3” SiC substrates is used for evaluation of their crystal quality.

Abstract: Growth of 4H-SiC bulk crystals on 4H-SiC {03-38} seeds was done. 4H-SiC {03-38} is obtained by inclining the c-plane toward <01-10> at a 54.7 degrees angle. Growth on the 4H-SiC {03-38} seed has the potential to achieve high quality crystals without micropipes and stacking faults. Micropipe-free c-plane 4H-SiC wafers were achieved by growth on the 4H-SiC {03-38} seed. A transmission X-ray topograph image of the micropipe free c-plane wafer revealed that there are no macroscopic defects with displacements.

Abstract: We report on fabrication and characterization of n-channel Si face 4H-SiC MOSFETs made using sublimation grown epitaxial material. Transistors made on this material exhibit record-high peak field effect mobility of 208 cm2/Vs while reference transistors made on a commercial epitaxial material grown by chemical vapor deposition (CVD) show field effect mobility of 125 cm2/Vs. The mobility enhancement is attributed to better surface morphology of the sublimation grown epitaxial layer.

Abstract: Growth of 4H-SiC epitaxial layers has been performed in a horizontal hot-wall CVD (chemical vapor deposition) reactor using the silane-propane-hydrogen system. Two inch 4H-SiC, C-face wafers with an off-cut angle of about 7° towards <11 2 0> direction have been used as substrates. Micropipe dissociation has been investigated by varying the carbon-silicon (C/Si) ratio in the source gas atmosphere. Depending on the C/Si ratio the micropipes propagate into the layer without changing their image (C/Si > 1) or they dissociate in separate dislocations leaving a scar like formed surface region (C/Si £ 1). The substrates including epitaxial layers of reduced micropipe density were used as seeds for bulk crystal growth. If a micropipe is once closed in an epilayer grown at a low C/Si ratio, it is not opened in the subsequent growth process at high temperature.