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Articles by keyword: «Ultra Low-k»

• Advances in Test Wafer Reclaim Technology – Wet Stripping Porous Low-k Films with No Substrate Damage
  Published in: Ultra Clean Processing of Semiconductor Surfaces IX (p339)
• Compatibility of Supercritical Co₂-Based Stripping with Porous Ultra Low-k Materials and Copper
  Published in: Ultra Clean Processing of Silicon Surfaces VI (p113)
• Qualification of Resist Strip Process for Ultra Low-k/Cu Interconnect
  Published in: Ultra Clean Processing of Silicon Surfaces VII (p345)
• Study of Resist Strip Chemistries for Ultra Low-k/Cu Interconnect
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p351)
• Wet Clean Induce Pattern Collapse Mechanism Study
  Published in: Ultra Clean Processing of Semiconductor Surfaces X (p253)