Relationship between the Grit Cut Depth and Process Parameters in Electroplated Diamond Wire Sawing KDP Crystal

Abstract:

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A wire-saw cut KDP crystal geometrical model was founded and a mathematical model was established to calculate the grit average cut depth, based on indentation fracture mechanics theory(IFMT). The relationship between the grit cut depth and wire saw process parameter was analyzed theoretically. The research results indicate that there exists an approximate monotone increasing non-linear correlation between grit average cut depth and the ratio i value of crystal feed speed and wire speed. By increasing the wire speed and crystal feed speed accordantly, the value of i can be maintained invariable, however, this way can simultaneously bring higher machined surface quality and machining efficiency.

Info:

Periodical:

Edited by:

Di Zheng, Yiqiang Wang, Yi-Min Deng, Aibing Yu and Weihua Li

Pages:

950-953

DOI:

10.4028/www.scientific.net/AMM.101-102.950

Citation:

Y. F. Gao and P. Q. Ge, "Relationship between the Grit Cut Depth and Process Parameters in Electroplated Diamond Wire Sawing KDP Crystal", Applied Mechanics and Materials, Vols. 101-102, pp. 950-953, 2012

Online since:

September 2011

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$35.00

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