Relationship between the Grit Cut Depth and Process Parameters in Electroplated Diamond Wire Sawing KDP Crystal

Yu Fei Gao; Pei Qi Ge

doi:10.4028/www.scientific.net/AMM.101-102.950

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 101-102Relationship between the Grit Cut Depth and...

Relationship between the Grit Cut Depth and Process Parameters in Electroplated Diamond Wire Sawing KDP Crystal

Abstract:

A wire-saw cut KDP crystal geometrical model was founded and a mathematical model was established to calculate the grit average cut depth, based on indentation fracture mechanics theory(IFMT). The relationship between the grit cut depth and wire saw process parameter was analyzed theoretically. The research results indicate that there exists an approximate monotone increasing non-linear correlation between grit average cut depth and the ratio i value of crystal feed speed and wire speed. By increasing the wire speed and crystal feed speed accordantly, the value of i can be maintained invariable, however, this way can simultaneously bring higher machined surface quality and machining efficiency.

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Periodical:

Applied Mechanics and Materials (Volumes 101-102)

Pages:

950-953

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.101-102.950

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Online since:

September 2011

Authors:

Yu Fei Gao, Pei Qi Ge

Keywords:

Grit Cut Depth, KDP Crystal, Process Parameter, Wire Saw

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References

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