Design and Optimization of the Deposition Baffle Shape for Magnetron Sputtering

Abstract:

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This resistance by tests to simulate the sputtering thickness distribution and the relative value, we try to reduce the degree of uneven thickness by designing baffle shape for the coating equipment. In view of the structural characteristics of the device and the deposition of complex principles, theory and practice there are still some gaps, according to the measured data (resistance value) to be constantly revised to optimize and baffle design to achieve greater uniformity of product thickness. For example, to meet the resistivity greater than or equal 9.6 Ω and the average transmittance above 80%, TiO2/Ag/TiO2 film fully met the requirements of practical applications by applying improved baffle. Concluding remarks are stated at the end of the abstract text. Based on the use of a simple baffle design and improvement, we had achieved good results in mastering the sputtering parameters.

Info:

Periodical:

Edited by:

Huixuan Zhang, Ye Han, Fuxiao Chen and Jiuba Wen

Pages:

1580-1583

DOI:

10.4028/www.scientific.net/AMM.117-119.1580

Citation:

H. F. Chen et al., "Design and Optimization of the Deposition Baffle Shape for Magnetron Sputtering", Applied Mechanics and Materials, Vols. 117-119, pp. 1580-1583, 2012

Online since:

October 2011

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Price:

$35.00

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