Numerical Simulation of Cu-Cu Interface Thermal Resistance by Utilizing Laser Photothermal Method

Abstract:

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By using the high purity Cu samples as the study objects and based on the experimental measurement results of the interface thermal resistance, the study on the relations between the interface thermal resistance, the laser modulation frequency and the phase lag under different temperatures has been carried out through the Matlab numerical simulation. It is shown that the corresponding phase lag is increasingly bigger but the interface thermal resistance is increasingly smaller while the interface temperature become higher at a certain pressure; furthermore, the study on relation between the interface thermal resistance and the temperature variation has been carried out and it may be concluded based on the analysis that the interface thermal resistance changes remarkably while the temperature scope is from 20K to 60K and the interface thermal resistance varies slightly while the temperature scope is from 60K to 120K.

Info:

Periodical:

Edited by:

Huixuan Zhang, Ye Han, Fuxiao Chen and Jiuba Wen

Pages:

195-200

DOI:

10.4028/www.scientific.net/AMM.117-119.195

Citation:

Q. Z. Zhang et al., "Numerical Simulation of Cu-Cu Interface Thermal Resistance by Utilizing Laser Photothermal Method", Applied Mechanics and Materials, Vols. 117-119, pp. 195-200, 2012

Online since:

October 2011

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Price:

$35.00

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