Numerical Simulation of Cu-Cu Interface Thermal Resistance by Utilizing Laser Photothermal Method

Qing Zhi Zhang; Gang Wu; Zhi Yang Pang; Jin Zeng Chen; Guang Hua Li; Ke Bi

doi:10.4028/www.scientific.net/AMM.117-119.195

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 117-119Numerical Simulation of Cu-Cu Interface Thermal...

Numerical Simulation of Cu-Cu Interface Thermal Resistance by Utilizing Laser Photothermal Method

Abstract:

By using the high purity Cu samples as the study objects and based on the experimental measurement results of the interface thermal resistance, the study on the relations between the interface thermal resistance, the laser modulation frequency and the phase lag under different temperatures has been carried out through the Matlab numerical simulation. It is shown that the corresponding phase lag is increasingly bigger but the interface thermal resistance is increasingly smaller while the interface temperature become higher at a certain pressure; furthermore, the study on relation between the interface thermal resistance and the temperature variation has been carried out and it may be concluded based on the analysis that the interface thermal resistance changes remarkably while the temperature scope is from 20K to 60K and the interface thermal resistance varies slightly while the temperature scope is from 60K to 120K.

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Periodical:

Applied Mechanics and Materials (Volumes 117-119)

Pages:

195-200

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.117-119.195

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Online since:

October 2011

Authors:

Qing Zhi Zhang, Gang Wu, Zhi Yang Pang, Jin Zeng Chen, Guang Hua Li, Ke Bi

Keywords:

Cryogenic Engineering, Interface Thermal Resistance, Laser Photothermal Method, Numerical Simulation

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