[1]
Sun DQ, Gu XY, Liu WH: Mater. Sci. Eng-A Vol. 391 (2005), p.29.
Google Scholar
[2]
G. Mahendran, V. Balasubramanian, T. Senthilvelan : Materials and Design. Vol. 30 (2009) 1240–1244.
Google Scholar
[3]
AMunitz, C. Cotler, A. Stem, G. Kohn: Materials Science and Engineering A Vol. 302 (2001), p.68.
Google Scholar
[4]
J. A. Esparza, W.C. Davis, E.A. Trillo and L.E. Murr: Materials Science Vol. 21(12) (2001), p.917.
Google Scholar
[5]
Hidetoshi Somekawa, Hiroyuki Watanabe, Toshiji Mukai and Kenji Higashi: Scripta Materialia, Vol. 48(2003) , p.1249.
Google Scholar
[6]
Partridge PG, Ward-Close CM. Met Mater 1989; 5: 334.
Google Scholar
[7]
Duarte LI, Ramos AS, Vieira MF, Viana F, Vieira MT, Kocak M. Solid-state diffusion bonding of gamma-TiAl alloys using Ti/Al thin films as interlayers. Intermetallics 2006; 14: 1151–6.
DOI: 10.1016/j.intermet.2005.12.011
Google Scholar
[8]
Juan W, Yajiang L, Haijun M. Study of diffusion bonding of Fe–28Al alloy with austenitic stainless steel in vacuum. Vacuum 2006; 80: 426–31.
DOI: 10.1016/j.vacuum.2005.07.007
Google Scholar
[9]
Torun O, Gürler R, Baksan B, Çelikyürek I. Diffusion bonding of iron aluminide Fe72Al28 using a pure iron interlayer. Intermetallics 2005; 13: 801–4.
DOI: 10.1016/j.intermet.2005.01.002
Google Scholar
[10]
M. Joseph Fernandus, T. Senthikumar and V. Balasubramanian: Materials and Design Vol. 32 (2011), p.1651.
Google Scholar
[11]
G. Mahendran, V. Balasubramanian, and T. Senthilvelan: Materials and Design Vol. 30 (2009), p.1240.
Google Scholar
[12]
Feng JC, Zhang BG, Qian YY, He P Materials Characterization Vol. 48 (2002), p.401.
Google Scholar