Effect of Black Plate on Growth Action and Corrosion Resistance of Sn-Fe Alloy Film

Jian Zhong Li; Yan Wen Tian; Ying Li; Yu Cheng Wang

doi:10.4028/www.scientific.net/AMM.121-126.100

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 121-126Effect of Black Plate on Growth Action and...

Effect of Black Plate on Growth Action and Corrosion Resistance of Sn-Fe Alloy Film

Abstract:

Effect of black plate on growth action and corrosion resistance of Sn-Fe alloy film was investigated by means of metallurgical microscope, scanning electron microscopy (SEM), salt spray corrosion test and electrochemistry methods. The results show that the different modes of annealing and rolling have a remarkably effects on the surface morphology and grain size of Sn-Fe alloys. Crystalline grain of Sn-Fe alloy film for T4-CA or T2.5-BA is relatively continues, homogeneous and denser, but that for DR materials exists obviously surface inhomogeneity sizes and even void space of interweave. Rust spot easily generate on discontinuous alloy films or void space of interweave growth and gradually cover on the surface of Sn-Fe alloy films without corrosion damage. Corrosion resistance of BA materials is better than that of CA materials. Under the same annealing mode, corrosion resistance of DR materials is worse.

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Periodical:

Applied Mechanics and Materials (Volumes 121-126)

Pages:

100-104

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.121-126.100

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Online since:

October 2011

Authors:

Jian Zhong Li, Yan Wen Tian, Ying Li, Yu Cheng Wang

Keywords:

Black Plate, Corrosion Resistance, Electroplate, Growth Action, Sn-Fe Alloy Layer

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