The Efficiency of Thermoelectric Chip by Different Heatsink

Abstract:

In this study, aluminum nitride, boron nitride, copper, aluminum, with aluminum extruded heat sink as a cooling way of thermoelectric chip. Heat sink temperature change observed and measured the thermoelectric chip output voltage and current. The results showed that with the aluminum extrusion heat sink will increase the efficiency of thermoelectric chip. Copper + aluminum extrusion heat sink, the average electric power increased 173.93%, while the aluminum + aluminum extruded heat sink mean power increased 212.25 %, while the AlN + aluminum extrusion heat sink fins as mean power increased 197.5 %, And the BN + aluminum extrusion heat sink as a heat sink, the average electric power increased 266.17 %.

• Periodical: Applied Mechanics and Materials (Volumes 121-126)
• Pages: 2974-2978
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.121-126.2974
• Online since: October 2011
• Authors: Wern Dare Jheng, Shao Hsien Chen, Zhi Yu Lin
• Keywords: Aluminum Nitride (AlN), Boron Nitride, Heatsink, Thermoelectric Chip

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