Effect of Substrate Bias Voltage on the Mechanical and Tribological Properties of Low Concentration Ti-Containing Diamond Like Carbon Films

Article Preview

Abstract:

Ti containing hydrogenated diamond like carbon films (Ti-DLC) was deposited on Si substrates at room temperature by magnetron sputtering Ti-twin target in methane and argon mixture atmosphere via changing the substrate bias voltage. The Ti atomic concentration in the film is less than 0.57% and exists mainly in the form of metallic titanium rather than TiC, confirmed by XPS analysis. The internal compressive stress of the film decreases monotonically with the substrate bias voltage increase. However, the hardness values of the film keep at level (12 GPa) without almost any obvious change with the increase of the substrate bias voltage. Furthermore, Ti-containing DLC film prepared at -1600 V substrate bias voltage shows an extremely low wear rate (~10-9 mm3/Nm) and low friction coefficient (0.09).

You might also be interested in these eBooks

Info:

Periodical:

Pages:

232-236

Citation:

Online since:

June 2012

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2012 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] D. Caschera, et al.: Materials Science and Engineering C Forum Vol. 27 (2007), pp.1328-1330.

Google Scholar

[2] W. Zhang, A. Tanaka, K. Wazumi, Y. Koga: Thin Solid Films Forum Vol. 413 (2002), p.104.

Google Scholar

[3] F. Zhao, H. X. Li, L. Ji, etc.: Diamond & Related Materials Forum Vol. 19 (2010), pp.342-349.

Google Scholar

[4] A. Erdemir, C. Donnet: Journal of Physics D: Applied Physics Forum Vol. 39 (2006), p.311.

Google Scholar

[5] J. C. Sánchez-López, A. Fernández, in: C. Donnet, A. Erdemir, Springer, NY (2008), p.311.

Google Scholar

[6] W. Dai, H. Zheng, G. S. Wu, A. Y. Wang: Vacuum Forum Vol. 85 (2010), pp.231-235.

Google Scholar

[7] G. A. Zhang, J. Y. Zhang, et al.: Surf. Coat. Technol. Forum Vol. 202 (2008), pp.2684-2689.

Google Scholar

[8] W. J. Meng, B. A. Gillispie: Journal of Applied Physics Forum Vol. 84 (1998), p.4314.

Google Scholar

[9] A. Y. Wang, K. R. Lee, J. P. Ahn, J. H. Han: Carbon Forum Vol. 44 (2006), pp.1826-1832.

Google Scholar

[10] Y. T. Pei, C. Q. Chen, et al.: Acta. Mater. Forum Vol. 56 (2008), p.696.

Google Scholar

[11] J. Robertson: Materials Science and Engineering R: Reports Forum Vol. 37 (2002), p.129.

Google Scholar

[12] D. Kim, et al.: Nucl. Instrum. Methods Phys. Res. Sect. B Forum Vol. 254 (2007), p.93.

Google Scholar

[13] Y. N. Kok, et al.: Thin Solid Film Forum Vol. 475 (2005), p.219.

Google Scholar

[14] N. Paik: Surface & Coatings Technology Forum Vol. 200 (2005), pp.2170-2174.

Google Scholar