Consistency of High-g Acceleration Sensor Performance

Yun Bo Shi; He Zhang; Jun Liu; Ke Jie Li

doi:10.4028/www.scientific.net/AMM.184-185.101

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 184-185Consistency of High-g Acceleration Sensor...

Consistency of High-g Acceleration Sensor Performance

Abstract:

Based on the designed, packaged high-g acceleration sensor in measuring demonstrated sensor performance between individuals have big difference, Researched this problem, through the analysis that the main reason of this problem appeared in the sensor package process of Die process. Through ANSYS simulation and experimental test on two aspects of the analysis the die adhesive’s amount of Die process is the high-g acceleration sensor in testing large performance differences were the main factors. Packaged high-g acceleration sensors with die process of quantitative die adhesive were designed and tested their performance. The result showed that, the simulation results were consistent with experimental results.

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Periodical:

Applied Mechanics and Materials (Volumes 184-185)

Pages:

101-104

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.184-185.101

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Online since:

June 2012

Authors:

Yun Bo Shi, He Zhang, Jun Liu, Ke Jie Li

Keywords:

ANSYS, Consistency, Die Adhesive, High-G Acceleration Sensor, Test

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