Cushioning Package Design for Notebook Computer with Corrugated Cardboard

Abstract:

In this paper, a method is proposed for the cushioning package design of notebook computers with total corrugated cardboard through the market survey currently. A way of the evaluation for cushion package design for notebook computers is mentioned as simulation technology. A simple simulation model of the cushioning package of notebook computers has been made drop analysis and stress analysis by use of simulation software ANSYS. It has verified the feasibility and practicality of the method of whole corrugated cardboard cushioning package design. It has pointed out the direction of the development of the cushioning package design for notebook computers.

• Periodical: Applied Mechanics and Materials (Volume 200)
• Pages: 86-89
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.200.86
• Online since: October 2012
• Authors: Yue Qing Xing, Guo Zhi Li, Ning Wei
• Keywords: Corrugated Cardboard, Cushion Package, Notebook Computer, Simulation Analysis

References

[1] G.X. Pang: Logistics and Transport Packaging (Printing Industries Press, China 2006).

[2] C. Sun: Package Structure Design (China Light Industry Press, China 2010).

[3] Robert D. Thompson: MFC Developers Reference Manual (Mechanical Industry Press, China 1998).

[4] J.M. Shan: Packaging Testing Technology (Printing Industries Press, China 1999).

[5] J.Q. Wang: Packaging Materials (National Defense Industry Press, China 2004).

[6] G.X. Pang and B.T. Zhang: Packaging Engineering, Vol. 28 (2007), pp.19-21.

[7] T. He: The Nonlinear Finite Element Analysis Instance Tutorial of the ANSYS 10.0/LS-DYNA (Mechanical Industry Press, China 2007).