A New Method for Constructing Damage Boundary Curve Using Shock Response Spectra

Article Preview

Abstract:

The theory and methods of damage boundary curve (DBC) based on input excitation accelerations have played important role in transportation packaging designs for commodities. However, in many cases the designed cushion pads according to the concept of traditional DBC can transmit a higher acceleration than the maximum critical acceleration and yet still not cause any damage to the products. That means the conservatism exist in the traditional theory and method, which would bring over package and result in the rise of transport cost and more wastes of packaging materials. Thus, constructing new DBC are necessary in cushioning packaging designs of commercial products. In this paper, we developed a new drawing method and procedure for constructing new DBC based on response accelerations and Biot Model which is different from traditional DBC based on excitation ones. The new DBC is beneficial to overcome the conversation brought by the traditional DBC in transport packaging design, and it may have a wider application in transport packaging design for commodities.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

98-103

Citation:

Online since:

October 2012

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2012 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] R.E. Newton:Lansmont Corporation,17 Mandeville Ct.,Montery, CA 93940,USA.

Google Scholar

[2] R.D. Mindlin: Bell System Technical.Vol.24,1945.

Google Scholar

[3] K.Rchard,J. Brandeburg, J.L. Lee: Fundamentals of Packaging Dynamics.MTS System Corp.USA.1985.

Google Scholar

[4] 5-Step Package Development.MTS System Corp.USA.1985.

Google Scholar

[5] G.X. Peng R.D. Wang Y.H. Gao: Cushioning Packaging Dynamics.Hunan University Press,China.

Google Scholar

[6] B.F. Song:Packaging Engineering,(2004) No.1, pp.16-17(in Chinese).

Google Scholar

[7] J.H. Liu,S.Li: Packaging Engineering,(2006) No.4, pp.29-30(in Chinese).

Google Scholar

[8] B.S. Wang H.Y. Hao E.K. Kou.: Packaging Engineering,(2008) No.12, pp.27-29(in Chinese).

Google Scholar

[9] W.R. Armstrong: Best of TransPack,Editor: R.M. Fiedler.IOPP,USA.1996, pp.167-181.

Google Scholar

[10] I.K. William: Packaging Tech.and Sci.Vol.13(2000), pp.89-98.

Google Scholar

[11] J.E. Alexander: Sound and Vibration.June/2009, pp.6-15.

Google Scholar

[12] D.Schiff:Dynamics Analysis and Failure Modes of Simple Structures.John Wiley&Sons,Inc.USA.1990.

Google Scholar