Micro Dimple Fabrication on OFHC Copper by Laser Shock Processing

Abstract:

Micro dimples have been generally considered as a valuable texture which can improve lubrication and reduce wear of the sliding surfaces by acting as reservoirs of lubricants and grinding debris. Laser shock processing (LSP) is an innovative surface treatment technology which can modify metals and shape metallic parts accurately. In this study, a new process for micro dimple fabrication which could be called laser peen texturing (LPT) was proposed based on LSP. LPT experiments were performed on Oxygen-Free High Conductivity (OFHC) copper. Influences of experimental parameters on geometrical characteristics of micro dimples were investigated. It was found that after LPT, the pile up was generated around the dimple .The diameter, depth and aspect ratio of the micro dimples increase with the laser power density and repeated shock number, but all of them saturated gradually. From matellographic analysis, grain refinement was observed obviously beneath the dimple.

• Periodical: Applied Mechanics and Materials (Volumes 217-219)
• Pages: 2246-2251
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.217-219.2246
• Online since: November 2012
• Authors: Kang Mei Li, Yong Xiang Hu, Zhen Qiang Yao
• Keywords: Laser Shock Processing, Micro Dimple, OFHC Copper

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