Study on CMP Intelligent Monitoring System of Large-Size Silicon

Xiao Guang Guo; Xiao Ji Zhang; Dong Ming Guo

doi:10.4028/www.scientific.net/AMM.220-223.1414

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 220-223Study on CMP Intelligent Monitoring System of...

Study on CMP Intelligent Monitoring System of Large-Size Silicon

Abstract:

The design ideas of intelligent control and the influence mechanism of process parameters on chemical mechanical polishing (CMP) are combined to develop the CMP intelligent monitoring system, which has the function of learning, inference and memory. The system can be used in many kinds of CMP facilities, the process parameter from the system can be used to control each unit of the CMP facility. And compared with the past way of processing by virtue of experience, the system has friendly operating interface and is easy to operate. The volume production of silicon wafers can be achieved by the total CMP intelligent monitoring. The efficiency of production can be improved highly on condition that the quality can be ensured.

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Periodical:

Applied Mechanics and Materials (Volumes 220-223)

Pages:

1414-1417

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.220-223.1414

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Online since:

November 2012

Authors:

Xiao Guang Guo, Xiao Ji Zhang, Dong Ming Guo

Keywords:

Chemical Mechanical Polishing (CMP), Efficiency of Production, Intelligent Monitoring, Process Parameter, Silicon Wafer

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