The Improvement of Pcb’S Electroplating Uniformity

Zheng Jia; Sheng Tao Zhang; Dong Liu; Wei He; Dainan Zhang

doi:10.4028/www.scientific.net/AMM.236-237.158

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 236-237The Improvement of Pcb’S Electroplating Uniformity

The Improvement of Pcb’S Electroplating Uniformity

Abstract:

The uniformity of plating copper layer thickness and film clip rate is one of the important indicator of PCB’s quality, which will affect depply by electroplating. This papar think about it from the uniformity of electric field distribution, and try to make the PCB have copper coating uniformity higher than 90% and rang less than 12 m through optimization the process parameters of the core equipment in the process of copper - Tong Gang, thereby reducing the positive film clip rate, and improving the quality of PCB. The main process parameters needed to optimize in this article is the anode placement, anode length and so on

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Periodical:

Applied Mechanics and Materials (Volumes 236-237)

Pages:

158-162

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.236-237.158

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Online since:

November 2012

Authors:

Zheng Jia, Sheng Tao Zhang, Dong Liu, Wei He, Dainan Zhang

Keywords:

Electroplating Uniformity, Film Clipping, Printed Circuit Board (PCB), Transforming

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References

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