Preparation and Thermal Conductivity Behavior of Elastomeric Silicon Rubber-Aluminum Nitride Composite

Jin Chen; Xiang Gang Wang; Hai Yan Zhang

doi:10.4028/www.scientific.net/AMM.251.338

Paper Titles

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Application of PAN-Based Carbon Fibers as Brush Anode in Microbial Fuel Cells for Higher Electricity Production
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Effect of Surface Treatment on the Morphology of Si₃N₄ Nanowires
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Preparation and Thermal Conductivity Behavior of Elastomeric Silicon Rubber-Aluminum Nitride Composite
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Hydrogen Storage in Carbon Nanotubes Prepared by Using Copper Nanoparticles as Catalyst
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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 251Preparation and Thermal Conductivity Behavior of...

Preparation and Thermal Conductivity Behavior of Elastomeric Silicon Rubber-Aluminum Nitride Composite

Abstract:

The thermal conductive silicon rubber have been prepared by using aluminum nitride as filler. The morphology and dispersion propriety of the filler were investigated by Scanning electron microscopy. The thermal conductivity of the composites was analysized by thermal measurement system. The results show that The larger particles give rise to a higher thermal conductivity of composites, at the same time the thermal conductivity of the composites increase with increase of aluminum nitride filler fraction. When the particle size is 60 nm, the thermal conductivity of composites at 40% volume fraction is about 3.5times that of pure silicon rubber matrix.

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Periodical:

Applied Mechanics and Materials (Volume 251)

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338-341

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.251.338

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Online since:

December 2012

Authors:

Jin Chen, Xiang Gang Wang, Hai Yan Zhang

Keywords:

Aluminum Nitride (AlN), Silicon Rubber, Thermal Conductivity (TC)

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References

[1] Boukai AI, Bunimovich Y, Tahir-Kheli J, et al. Silicon nanowires as efﬁcient thermoelectric materials. Nature 2008;451(7175):168–171.

DOI: 10.1038/nature06458

Google Scholar

[2] Cui Y, Wei QQ, Park HK, et al. Multiplexed electrical detection of cancer markers with nanowire sensor arrays. Science 2001; 293(5533):1289–1292.

Google Scholar

[3] Cui Y, Lieber CM. Functional nanoscale electronic devices assembled using silicon nanowire building blocks. Science 2001;291(5505): 851–853.

DOI: 10.1126/science.291.5505.851

Google Scholar

[4] Wagner RS, Ellis WC. Vapor–liquid–solid mechanism of single crystal growth. Appl Phys Lett 2004;4:89-96.

Google Scholar

[5] Duan XF, Lieber CM. General synthesis of compound semiconductornanowires. Adv Mater 2000;12:298-302.

Google Scholar

[6] Westwater J, Gosain DP, Tomiya S, et al. Growth of silicon nanowires via gold/silane vapor-liquid-solid reaction. J Vac Sci Technol B1997;15(3):554–557.

DOI: 10.1116/1.589291

Google Scholar

[7] Reguer A, Bedu F, Dallaporta H, et al. Structural and electrical studies of conductive nanowires prepared by focused ion beam induced deposition. J Vac Sci Technol B 2008;26(1):175–180.

DOI: 10.1116/1.2830630

Google Scholar

[8] Haitao Zhu, Canying Zhang, Shiquan Liu Yaming Tang Yansheng Yin .Effects of nanoparticle clustering and alignment on thermal conductivities of Fe3O4 aqueous nanoﬂuids App Phy Let ,2006,89: 023-027.

DOI: 10.1063/1.2221905

Google Scholar

[9] L.C. Sima, S.R. Ramanana, H. Ismaila, K.N. Seetharamub, T.J. Thermal characterization of Al2O3 and ZnO reinforced silicone rubber as thermal pads for heat dissipation purposes. Gohc Thermochimica Acta 430 (2005):155–165

DOI: 10.1016/j.tca.2004.12.024

Google Scholar