Machine Vision-Aided Quality Decision System for Solder Joint Defect Evaluation

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To improve the printed circuit board (PCB) manufacturing process, it is important to have an automatic inspection system that classifies information regarding defects in solder joints. This paper proposes a quality decision system for solder joint defect classification on a PCB. An experiment was conducted to demonstrate the application of the system. The results showed that the inspection accuracy reached 94%, which is superior to the results achieved by other methods. The results of this study provide an effective solution for the inspection of the solder joint quality.

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1393-1397

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December 2012

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© 2013 Trans Tech Publications Ltd. All Rights Reserved

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