Temperature Field Reconstruction System Based on Ultrasonic Time-of-Flight Technique

Hua Yu Zhang; Ke Bao Xu; Feng Qin Xie; Ya Liu

doi:10.4028/www.scientific.net/AMM.271-272.1675

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 271-272Temperature Field Reconstruction System Based on...

Temperature Field Reconstruction System Based on Ultrasonic Time-of-Flight Technique

Abstract:

A temperature field related with ultrasonic propagation in the air according to the different velocity in different temperature can be reconstructed with the TOF (time of flight) measurement at different temperatures. One method of two-dimensional temperature field reconstruction has been proposed in this paper based on ultrasonic time-of-flight technique. The temperature of the total temperature field has been calculated with the method of 2-dimensional interpolation according to the temperature values measured with 8 ultrasonic sensors which has the functions of signal sending and receiving distributed around the measured field with given position. 4 thermocouples have been used to check the result of reconstruct temperature field in the experiment. The disturbance of temperature sensors distribution with the traditional ways has been avoided with little influence between the each sub-field divided by 8 temperature sensors with the given reconstruction in this paper.

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Periodical:

Applied Mechanics and Materials (Volumes 271-272)

Pages:

1675-1679

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.271-272.1675

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Online since:

December 2012

Authors:

Hua Yu Zhang, Ke Bao Xu, Feng Qin Xie, Ya Liu

Keywords:

Grid, Microprocessor, Reconstruction, Temperature Field, Time of Flight, Ultrasonic

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