Fabrication and Characterization of Cu-Plated Fine Pitch Patterns on Flexible Polyimide

Abstract:

The thin flexible Polyimides (PI) films have desirable properties for use in the electrical and electronics industry because their good thermal stability, high flexibility, low dielectric constants, excellent mechanical strength, low loss tangent, low relative permittivity and electrical insulating properties. In order to determine the process window of the surface metallization of PI, the fine traces with 50 micron pitch (25micron line /space) built on a flexible 50 micron thick PI film using wet fabrication process are reported in this paper. The thick copper (Cu) film was obtained from the Cu plating process using evaporated thin film of Cu as the adhesion layer. The fabricated fanout fine patterns are further investigated using scanning electron microscope (SEM), energy-dispersive spectrometry (EDS) and X-ray spectrometry technologies. The experiment is conducted to study the effect of the process parameters on the Cu film surface properties. The results obtained in this work can be applied to the fabrication of flexible microelectronic devices.

• Periodical: Applied Mechanics and Materials (Volumes 284-287)
• Pages: 118-122
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.284-287.118
• Online since: January 2013
• Authors: Ying Chih Wu, Yu Jung Huang, Ming Kun Chen, Yi Lung Lin, Ling Sheng Jang
• Keywords: Energy-Dispersive Spectrometry (EDS), Plating, Polyimide (PI), Scanning Electron Microscope (SEM), X-Ray Spectrometry

References

[1] J. S. Han, Z. Y. Tan, K. Sato, and M Shikida, Journal of Micromechanics and Micro-engineering, Vol. 14, No 1, p.200 (2000).

[2] P. C. Chiang, W. T. Whanga, M. H. Tsaib, and S. C. Wua, Thin Solid Films 447-448, pp.359-364 (2004).

[3] L. Lia, G. Yana, J. Wua, X. Yua, Q. Guoa, and E. Kang, Applied Surface Science, Vol. 254, No 22, pp.7331-7335, 15 Sep. (2008).

[4] Y. Kim, J. Keum, J.G. Kim, H. Lim, and C.S. Ha, Advanced Materials for Optics and Electronics, Vol. 10, Iss. 6, pp.273-283 (2000).

[5] K. L. Mittal, Polyimides. Plenum, New York (1984).

[6] D. Wilson, H.D. Stenzenberger, and P.M. Hergenrother, Chapman & Hall, New York (1990).

[7] G.H. Yang, E.T. Kang, K.G. Neoh, Y. Zhang, and K.L. Tan, Colloid and Polymer Science 279, pp.745-753 (2001).

[8] K. Kordas, S. Leppävuori, A. Uusimäki, F.G. Thomas, L. Nanai, R. Vajtai, K. Bali, and J. Bekesi, Thin Solid Films 384, pp.185-188 (2001).

DOI: 10.1016/s0040-6090(00)01829-0

[9] K. Akamatsu, S. Ikeda, and H. Nawafune Langmuir 19, pp.10366-10371 (2003).

[10] M.K. Ghosh, K.L. Mittal (Eds. ), Marcel Dekker, New York (1996).

[11] S. P. Murarka, I.V. Verner, R. J. Gutmann, Wiley, New York (2000).

[12] R. Rosenberg, D. C. Edelstein, C. K. Hu, K. P. Rodbell, Annual Review of Materials Research 30, pp.229-262 (2000).

[13] J.H. Glezen, H.A. Naseem, R.K. Ulricht, L.W. Schaper, and W.D. Brown, IEEE International Conference on Multichip Modules (1997).

DOI: 10.1109/icmcm.1997.581178

[14] S.C. Chang, J.M. Shied, and M.S. Feng, Journal of Vacuum Science and Technology. B 19(3), May/June (2001).