Tensile Testing of MEMS Materials at High Temperatures

William N. Sharpe

doi:10.4028/www.scientific.net/AMM.3-4.59

Paper Titles

Experimental Application of the Virtual Fields Method to Elasto-Plastic Behaviour
p.33

Elastic-Plastic Stress Analyses by Digital Image Correlation and Nonlinear Hybrid Method
p.39

Thermoelastic Stress Analysis of Nitinol Self-Expanding Stents
p.47

A New Method of Measuring Young's Modulus for Flexible Thin Materials Using a Cantilever
p.53

Tensile Testing of MEMS Materials at High Temperatures
p.59

In Situ Measurement of Internal Stress in Electroless Plating by Television Holographic Interferometry
p.65

Fatigue Limit Evaluations of a Complex Structure by Using Temperature Measurements
p.71

Design of an Ultrasonic Blade for Cutting Bone
p.79

FE Simulation of Laser Ultrasonic Surface Waves in a Biomaterial Model
p.85

HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 3-4Tensile Testing of MEMS Materials at High...

Tensile Testing of MEMS Materials at High Temperatures

Abstract:

This paper presents three kinds of high-temperature test methods for three different materials along with the results. Resistively heated polysilicon film 3.5 micron thick shows ductile behavior at 500°C. Resistively heated nickel 200 microns thick shows decreasing strength at 400°C. Furnace heated silicon carbide 200 microns thick maintains its strength at 1000°C. Strain is measured by laser-based interferometry in the first two cases to obtain complete stress-strain curves, while force-displacement is measured in the third case.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Applied Mechanics and Materials (Volumes 3-4)

Pages:

59-64

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.3-4.59

Citation:

Cite this paper

Online since:

August 2006

Authors:

William N. Sharpe

Keywords:

Fracture Strength, High-Temperature, Interferometry, Micro-Electromechanical System (MEMS), Microsystems, Nickel Ni, Poly-Silicon, Silicon Carbide (SiC), Stress-Strain Curve

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] W. N. Sharpe, Jr. and C-S Oh: Proceedings of ATEM'03, Japan Society of Mechanical Engineers, Nagoya, Japan (2003), Paper OS06W0394 on CD.

Google Scholar

[2] W. N. Sharpe, Jr. and C-S Oh: Proceedings Of IMECE 2003 - ASME, Washington, DC (2003), on CD.

Google Scholar

[3] M. Zupan, M.J. Hayden, C.J. Boehlert and K.J. Hemker: Experimental Mechanics Vol. 41 (2001), p.242.

Google Scholar

[4] H. S. Cho, K. J. Hemker, K. Lian and J. Gottert: Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS) (2002), p.439.

Google Scholar

[5] T. R. Christenson, T. E. Buchheit, D. T Schmale and R. J. Bourcier: Microelectromechanical Structures for Materials Research. Symposium -MRS (1998), p.185.

Google Scholar

[6] K. J. Hemker and H.R. Last: Materials Science and Engineering A Vol. 319 (2001), p.882.

Google Scholar

[7] W. N. Sharpe, Jr., O. Jadaan, N. Nemeth and G. Beheim: Proceedings of the 2004 SEM Annual Conference, Costa Mesa, CA, (2004), Paper 405 on CD.

Google Scholar

[8] K. Li and W. N. Sharpe, Jr.: Journal of Engineering Materials and Technology Vol. 118 (1996), p.88.

Google Scholar

[9] J. Bagdahn, W. N. Sharpe, Jr. and O. Jadaan: Journal of Microelectromechanical Systems Vol. 12 (2003), p.302.

Google Scholar