Development of a Miniature Vapor-Compression Refrigeration System for Computer CPU Cooling

Abstract:

A miniature vapor-compression refrigeration system for cooling high power CPUs has been developed and tested. The refrigeration system is so small that it can be embedded into the computer case. The refrigerant used in the system is R-134a. The system consists of a miniature rotary DC compressor, a micro-channel condenser, a specially designed cold plate, a short tube restrictor, and related controlling electronics. The compressor is powered directly by the 12V DC power supply of the computer. The cold plate contacts the CPU surface directly and carries away the heat dissipation by conductivity. In a series of tests to cool an Intel Core i7-990X CPU that has 12 cores inside with the refrigeration system, the CPU core temperature can be kept at 23°C in default frequency 3.5GHz and 100% of workload. When the CPU is overclocked to 4.8GHz, the core temperature can be maintained at 59°C. Even when overclocked to 5.0GHz, the core temperature does not exceed 78°C. The test results validate the ability and potential of using vapor-compression refrigeration technology in high heat flux CPU cooling.

• Periodical: Applied Mechanics and Materials (Volumes 321-324)
• Pages: 383-386
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.321-324.383
• Online since: June 2013
• Authors: Yu Fei Yang, Wei Xing Yuan, Yi Bin Liao
• Keywords: CPU Cooling, Embedded, Overclock, Refrigeration, Vapor-Compression

References

[1] Information on http://www.itrs.net

[2] P.E. Phelan, V.A. Chiriac, T. Yu, in: IEEE Transactions on Components and Packaging Technologies, Vol. 25 (2002)

[3] S. Trutassanawin, E.A. Groll, S.V. Garimella and L. Cremaschi, in: IEEE Transaction on Component and Packaging Technologies, Vol. 29 (2006)

[4] Z. Wu, R. Du: App. Therm. Eng., Vol. 31 (2011), pp.385-390

[5] A. A. Sathe, E. A. Groll and S. V. Garimella, in: International Compressor Engineering Conference at Purdue, West Lafayette, IN (2008)

[6] G. Deming, R. Wysk and K. P. Lee: Electronic Cooling, Vol. 5 (2008)

[7] J.J. Brandner, E. Anurjew and L. Bohn: Exp. Therm. and Fluid Sci., Vol. 30 (2006), p.801–809

[8] Y. P. Chang, R. Tsai and J. W. Hwang: App. Therm. Eng., Vol. 17 (1997), p.1055–1065