Wireless Thermal Convection Accelerometer on a RFID-Tag with Heater and Thermal Piles Deposited by E-Beam

Abstract:

This paper proposes an innovative method to make a thermal convection accelerometer on an active RFID tag, thus the device is a wireless acceleration sensor and can save more power. The heaters and the thermal piles are deposited by E-beam focused on a target of mixing powders of metals on the RFID tag. Thus the new device is very easy to make. Besides, a hemi-cylindrical chamber and inert xenon (Xe) gas are used to replace the traditional rectangular one with carbon dioxide (CO₂). The gas molecular weight of Xe is three times larger than CO₂, so the xenon gas inertia is larger and can yield quicker response. Moreover, the proposed hemi-cylindrical chamber is more stream-line in nature, thus it is with less drag effect. Note the device sensitivity when using rectangular chamber and CO₂ gas is better at low acceleration. However, the performance is not only begin to decrease for acceleration larger than 18G (1G=9.8 m/s²), but even less than that using Xe gas for acceleration larger than 28G. Contrarily, when using the hemi-cylindrical chamber the device is without the above effects. Comparison of device response for step-input acceleration of 32G is also made; when using rectangular chamber and Xe gas the device response time is 31μs, but it is 60μs for the case with CO₂ gas. However, when using hemi-cylindrical chamber and Xe gas the device response time is 15μs, it is about 20.2% of CO₂ (74μs). Thus it is better to use either Xe gas or hemi-cylindrical chamber.

• Periodical: Applied Mechanics and Materials (Volume 328)
• Pages: 808-812
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.328.808
• Online since: June 2013
• Authors: Jium Ming Lin, Cheng Hung Lin
• Keywords: Hemi-Cylindrical Chamber, RFID-Tag, Thermal Accelerometer Accelerometer, Xenon Gas

References

[1] Y. Zhao, A. Leung, M.E. Rebeschini, G.P. Pucci, Dribinsky and B.A.Y. Cai, U.S. Patent 7,305,881 B2. (2007)

[2] K.M. Liao, R. Chen and B.C.S. Chou: Sensors and Actuators A: Physical Vol. 130-131 (2006), p.282

[3] J. Dido, P. Loisel and A. Renault, U.S. Patent 7, 426,862 B2. (2008)

[4] J. Courteaud, N. Crespy, P. Combette and B. Sorli: Sens. Actuators A: Physical Vol. 147 (2008), p.75

DOI: 10.1016/j.sna.2008.03.015

[5] T.R. Hsu: MEMS & Microsystems: Design and Manufacture (McGraw-Hill Companies, Inc., Boston, 2002).

[6] A. Garraud, A. Giani, P. Combette, B. Charlot and M. Richard: Sensors and Actuators A Physical Vol. 170 (2011), p.44

DOI: 10.1016/j.sna.2011.05.029

[7] F. Khoshnoud and C.W. de Silva: IEEE Instrumentation and Measurement Magazine Vol. 15 (2012), p.14

[8] A. Dribinsky, G.P. Pucci, Y. Cai, M. Varghese, G.J. O'Brien, Y. Zhao and Y.Y. Cai, U.S. Patent 7,862,229. (2011)

[9] B. Alain, R. Alain, V. Bernard and G. Alain, European Patent EP1550874. (2010)

[10] A.A. Rekik, F. Azaïs, N. Dumas, F. Mailly and P. Nouet: Journal of Electronic Testing, Vol. 27 (2011), p.411