Development of Waxless Wafer Mounting System for Silicon Wafer Polishing Process

Abstract:

In the silicon wafer polishing process, the mounting of wafer on the polishing head could be greatly influential in final quality of finished wafers. This paper focuses on the waxless wafer mounting technique which could replace the traditional wax wafer mounting. Mounting of wafers on the carrier block using a wetted porous template provides a simple way of securing wafer on polishing head for precision wafer polishing. Demounting of wafers from the porous pad is carried out by using the water jet impingement which takes only a couple of seconds for wafer demounting. A series of wafer polishing tests of 8 inch silicon wafers using the present wafer mounting system found that the developed waxless wafer mounting could be quite suitable for producing the wafers of the excellent surface qualities by meeting industry standard such as SBIR, LLS, and production yield.

• Periodical: Applied Mechanics and Materials (Volume 339)
• Pages: 762-765
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.339.762
• Online since: July 2013
• Authors: Kyoung Jin Kim
• Keywords: Silicon Wafer Polishing, Wafer Demounting, Waxless Wafer Mounting

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