Finite Element Modal Analysis of the Quick Positioning System of Wire Bonders

Abstract:

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The positioning system with high acceleration and high precision determines the speed and quality of bonding, which is the core component in a wire bonder, and influences the cost and reliability of the chip. The mode characteristics of the high acceleration and high precision positioning system were analyzed using ABAQUS. The results show that the system has different vibration characteristics in different resonance mode, and also has the features of mode denseness and complicated vibration mode.

Info:

Periodical:

Edited by:

Shengyi Li, Yingchun Liu, Rongbo Zhu, Hongguang Li, Wensi Ding

Pages:

1840-1844

DOI:

10.4028/www.scientific.net/AMM.34-35.1840

Citation:

Q. Bai et al., "Finite Element Modal Analysis of the Quick Positioning System of Wire Bonders", Applied Mechanics and Materials, Vols. 34-35, pp. 1840-1844, 2010

Online since:

October 2010

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Price:

$35.00

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