Research on Manufacturing Process of Buried/Blind via in HDI Rigid-Flex Board

Xin Hong Su; Yuan Ming Chen; Wei He; Shou Xu Wang; Zhi Hua Tao

doi:10.4028/www.scientific.net/AMM.365-366.527

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 365-366Research on Manufacturing Process of Buried/Blind...

Research on Manufacturing Process of Buried/Blind via in HDI Rigid-Flex Board

Abstract:

The trend towards portability of electronic products expands the application of rigid-flex board, which has become one of the hot spots in PCB industry. Along with the improvement of assembly technology, the improving design of rigid-flex board appears. High Density Interconnection (HDI) is one of the design directions. The key manufacturing parameters of buried /blind via process in manufacturing process of HDI rigid-flex board was studied in detail including material selections, laminate process, drilling process and via metallization. Better manufacturing parameters of buried /blind via were obtained through orthogonal design. It was found over 99.9% vias could pass the test on electrical performance.

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Periodical:

Applied Mechanics and Materials (Volumes 365-366)

Pages:

527-531

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.365-366.527

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Online since:

August 2013

Authors:

Xin Hong Su, Yuan Ming Chen, Wei He, Shou Xu Wang, Zhi Hua Tao

Keywords:

Buried/Blind via, Manufacturing Process, Rigid-Flex Board

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