Wettability of Carbon Nanotubes with Molten Sn-Ag-Cu Solder Alloy

Article Preview

Abstract:

The purpose of this work was to study the wettability of single-walled carbon nanotube (SWCNTs) and molten 96.5Sn-3.0Ag-0.5Cu (SAC305) lead-free solder alloy. The SWCNTs was coated with silver (Ag) by using an electroless plating method in order to enhance its wettability. The wetting behavior of molten SAC305 alloy on three different substrates, alumina, un-coated SWCNTs and Ag-coated SWCNTs was investigated by employing a modified sessile drop technique. The wetting angle between the molten SAC305 and the three substrates was measured at temperature range of 250-550 °C. The average wetting angles between the molten SAC305 and the alumina, the un-coated SWCNTs and the Ag-coated SWCNTs substrates were 130.7±1.3°, 128.4±4.2° and 120.1±3.5°, respectively. The wettabilty of the SWCNTs was improved by coating it with silver. The wetting angle of the Ag-coated SWCNTs was decreased approx. 9° compared to that of the un-coated. Increasing temperature has slightly affected on the wettability of SWCNTs and the molten SAC305.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

136-142

Citation:

Online since:

August 2013

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2013 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] S. Iijima, Helical microtubules of graphitic carbon, Nature. 354 (1991) 56-58.

DOI: 10.1038/354056a0

Google Scholar

[2] Z. Q. Xue, W. M. Liu, S. M. Hou, J. P. Sun, Z. J. Shi, Z. N. Gu, X. Y. Zhao, Z. X. Zhang, J. L. Wua, L. M. Peng, Q. D. Wu, study on electronic properties of single-wall carbon nanotubes, Mater. Sci. Eng. C. 16 (2001) 17-21.

DOI: 10.1016/s0928-4931(01)00290-9

Google Scholar

[3] K. M. Kumara, V. Kripesh, A. A. O. Tay, Single-wall carbon nanotube (SWCNT) functionalized Sn-Ag-Cu lead-free composite solder, J. Alloys Compd. 450 (2008) 229-237.

DOI: 10.1016/j.jallcom.2006.10.123

Google Scholar

[4] K. M. Kumar, V. Kripesh, A. A. O. Tay, Influence of single-wall carbon nanotube addition on the microstructural and tensile peoperties of Sn-Pb solder alloy, J. Alloys Compd. 455 (2008) 148-158.

DOI: 10.1016/j.jallcom.2007.01.045

Google Scholar

[5] K. M. Kumar, V. Kripesh, L. Shen, A. A. O. Tay, Study on the microstructure and mechanical properties of a navel SWCNT-reinforced solder alloy for ultra-fine pitch applications, Thin Solid Films. 504 (2006) 371-378.

DOI: 10.1016/j.tsf.2005.09.072

Google Scholar

[6] Y. Feng, H. Yuan, Electroless plating of carbon nanotubes with silver, J. Mater. Sci. 39 (2004) 3241-3243.

DOI: 10.1023/b:jmsc.0000025869.05546.94

Google Scholar

[7] H. Y. Song, X. W. Zha, Mechanical properties of nickel-coated single-walled carbon nanotubes and their embedded gold matrix composites, Phys. Lett. A. 374 (2010) 1068-1072.

DOI: 10.1016/j.physleta.2009.12.035

Google Scholar

[8] W. M. Daoush, B. K. Lim, C. B. Mo, D. H. Nam, S. H. Hong, Electrical and mechanical properties of carbon nanotube reinforced copper nanocomposites fabricated by electroless deposition process, Mater. Sci. Eng. A. 513-514 (2009) 247-253.

DOI: 10.1016/j.msea.2009.01.073

Google Scholar

[9] W. L. Liu, S. H. Hsieh, W. J. Chen, Preparation of Sn films deposited on carbon nanotubes, Appl. Surf. Sci. 253 (2007) 8356-8359.

DOI: 10.1016/j.apsusc.2007.03.069

Google Scholar

[10] D. L. Zhao, X. Li, Z. M. Shen, Microwave absorbing property and complex permittivity and permeability of epoxy composites containing Ni-coated and Ag filled carbon nanotubes, Comps. Sci. Technol. 68 (2008) 2902-2908.

DOI: 10.1016/j.compscitech.2007.10.006

Google Scholar

[11] X. Ma, X. Li, N. Lun, S. Wen, Synthesis of gold nano-catalysts supported on carbon nanotubes by using electroless plating technique, Mater. Chem. Phys. 97 (2006) 351-356.

DOI: 10.1016/j.matchemphys.2005.08.026

Google Scholar

[12] H. Liu, G. Cheng, R. Zheng, Y. Zhao, C. Liang, Influence of synthesis process on preparation and properties of Ni/CNT catalyst, Diam. Relat. Mater. 15 (2006) 15-21.

DOI: 10.1016/j.diamond.2005.06.022

Google Scholar

[13] F. Wang, S. Arai, M. Endo, The preparation of multi-walled carbon nanotubes with a Ni–P coating by an electroless deposition process, Carbon. 43 (2005) 1716-1721.

DOI: 10.1016/j.carbon.2005.02.015

Google Scholar

[14] F. Z. Kong, X. B. Zhang, W. Q. Xiong, F. Liu, W. Z. Huang, Y. L. Sun, J. P. Tu, X. W. Chen, Continuous Ni-layer on multiwall carbon nanotubes by an electroless plating method, Sure. Coat. Tech. 155 (2002) 33-36.

DOI: 10.1016/s0257-8972(02)00032-4

Google Scholar

[15] X. Chen, J. Xia, J. Peng, W. Li, S. Xie, Carbon-nanotube metal-matrix composites prepared by electroless plating, Compos. Sci. Technol. 60 (2000) 301-306.

DOI: 10.1016/s0266-3538(99)00127-x

Google Scholar

[16] H. Uozumi, K. Kobayashi, K. Nakanishi, T. Matsunaga, K. Shinozaki, H. Sakamoto, T. Tsukada, C. Masuda, M. Yoshida, Fabrication process of carbon nanotube/light metal matrix composites by squeeze casting, Mater. Sci. Eng. A. 495 (2008) 282-287.

DOI: 10.1016/j.msea.2007.11.088

Google Scholar

[17] H. Fujii, S. Izutani, T. Matsumoto, S. Kiguchi, K. Nogi, Evaluation of unusual change in contact angle between MgO and molten magnesium, Mater. Sci. Eng. A. 417 (2006) 99-103.

DOI: 10.1016/j.msea.2005.10.055

Google Scholar

[18] K. Kondoh, M. Kawakami, H. Imai, J. Umeda, H. Fujii, Wettability of pure Ti by molten pure Mg droplets, Acta Mater. 58 (2010) 606-614.

DOI: 10.1016/j.actamat.2009.09.039

Google Scholar

[19] M. F. Arenas, V. L. Acoff, Contact angle measurements of Sn-Ag and Sn-Cu lead-free solders on copper substrates, J. Electron, Mater. 33 12 (2004) 1452-1458.

DOI: 10.1007/s11664-004-0086-x

Google Scholar

[20] L. Zang, Z. Yuan, H. Zhao, X. Zhang, Wettability of molten Sn-Bi-Cu solder on Cu substrate, Mater. Lett. 63 (2009) 2067-(2069).

DOI: 10.1016/j.matlet.2009.06.052

Google Scholar

[21] Z. XiaoRui, Y. ZhangFu, Z. HongXin, Z. LiKun, L. JianQiang, Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate, Chinese Sci Bull. 55 9 (2010) 797-801.

DOI: 10.1007/s11434-010-0056-z

Google Scholar

[22] C. Xu, G. Wu, Z. Liu, D. Wu, T. T. Meek, Q. Han, Preparation of copper nanoparticles on carbon nanotubes by electroless plating method, Mater. Res. Bull. 39 (2004) 1499-1505.

DOI: 10.1016/j.materresbull.2004.04.021

Google Scholar

[23] W. Gasior, Z. Moser, J. Pstrus, K. Bukat, R. Kisiel, J. Sitek, (Sn-Ag)eut+ Cu soldering materials, part I: wettability studies, J. Phase. Equilib. Diff. 25 2 (2004) 115-121.

DOI: 10.1007/s11669-004-0003-2

Google Scholar

[24] Z. F. Yuan, K. Mukai, K. Takagi, M. Ohtaka, W. L. Huang, Q. S. Liu, Surface tension and its temperature coefficient of molten tin determined with the sessile drop method at different oxygen partial pressures, J. Colloid. Interf. Sci. 254 (2002).

DOI: 10.1006/jcis.2002.8589

Google Scholar