Stamp Tooling Application for High Power LED Packaging Fabrication

Zhan Feng Zhao

doi:10.4028/www.scientific.net/AMM.372.445

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 372Stamp Tooling Application for High Power LED...

Stamp Tooling Application for High Power LED Packaging Fabrication

Abstract:

The high power light emitting diodes unit internal structure was elaborated from materials and tooling point of view, the unit matrix layout in copper frame for mass production was presented for fully automatic stamping. The processes and tooling stations were decomposed and optimized according to the formulated stamping sequences, facilitating the downstream packaging processes. The final leads bending and unit singulation mechanisms were proposed. The universal tooling design scheme for multiple material composed opti-electric units can be referenced for similar integrated functional devices.

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Periodical:

Applied Mechanics and Materials (Volume 372)

Pages:

445-449

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.372.445

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Online since:

August 2013

Authors:

Zhan Feng Zhao

Keywords:

Light Emitting Diode (LED), Progressive Toolset, Stamping Technology, Unit Packaging

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References

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