Carbon Nanotubes: Good Candidate for VLSI Interconnects

Abstract:

Carbon nanotubes are being seen as a promising new class of electronic materials owing to the change in their properties with chirality and geometry of the nanotube. They are being considered for future VLSI applications due to their superior conductance and inductance properties which are important parameters while considering any material for an interconnect or via applications.In this paper, we report the variation in electrical and thermal conductance as well as inductance of a CNT with its geometrical features using a diameter dependent model. Also the dependence of conductance and inductance of a CNT on the type of nanotubes, tube length and tube diameter has been studied. As we know that at nanometre scale, the electrical and thermal transport properties of the components become extremely important as regards the functioning of the device and it is difficult to accurately measure these properties, therefore predictions using modeling and simulation play an important role in providing a guideline for design and fabrication of CNT interconnects and understanding the working of various other CNT based devices.

• Periodical: Applied Mechanics and Materials (Volume 378)
• Pages: 165-171
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.378.165
• Online since: August 2013
• Authors: Neeraj Jain, A.K. Aggarwal, P.K. Chaudhary
• Keywords: Carbon Nanotube (CN), Electrical Conductance, Inductance, Thermal Conductance

References

[1] A. Raychowdhury and K. Roy, IEEE Trans. TCAD, vol. 25, no. 1, p.5865, Jan. (2006).

[2] Avouris, P.; Wind, S.J.; Carbon nanotube electronics, IEEE proc., volume 91, 1772-1784, (2003).

[3] Brown, E.; Hao, L. ; Gallop, J.C.; Macfarlane, J.C.; Appl. Phys. Lett., 87, 023107, (2005).

[4] C. L. Cheung, A. Kurtz, H. Park and C. M. Lieber,. J. Phys. Chem. volume 106, 2429-2433, (2002).

[5] Cao, J.; Yan, X.; Xiao, Y.; Ding, J.; Phys. Rev. B, 69, 073407, (2004).

[6] H. J. Li, W. G. Lu, J. J. Li, X. D. Bai and C. Z. Gu, Phys. Rev. Lett. Vol. 95, no. 8, p.86601, Aug. (2005).

[7] Iijima, S.; Nature, 354, 56, (1991).

[8] J. Li, Q. Ye, A. Casssell, H. T. Ng, R. Stevens, J. Han and M. Meyyappan, APL vol. 82, pp.2491-2493, Apr. (2003).

[9] J X Cao, X H Yan, J W Ding and D L Wang, J. Phys.: Condens. Matter 13, L271–L275, (2001).

[10] Miano, G.; Villone, F., IEEE trans., volume 54, 2713-2724, (2006).

[11] Mintmire J W and White C T, Phys. Rev. Lett. 81 2506, (1998).

[12] Naeemi, A. ; Meindl; Sarvari, R., J.D.; IEEE Elec. Dev. Lett., volume 26, pp.84-86, (2005).

[13] Naeemi, A.; Meindl, J.D.; Compact physical models for CNT interconnects. IEEE Elec. Dev. Lett., vol. 27, 338-340, (2006).

[14] Neeraj Jain; Harsh; Nanoscience and Nanotechnology, volume 2, Issue 2-3, (2008).

[15] Neeraj Jain; Harsh; R K Sinha; J. Advanced Materials Research, volume 67 titled Nanomaterials & Devices, 109-114, (2009).

[16] S. Salahuddin, M. Lundstrom and S. Datta, IEEE Trans. Electron Devices, vol. 52, no. 8, pp.1734-1742, Aug. (2005).

DOI: 10.1109/ted.2005.852170

[17] S. Sato; et. Al; Inter. Interconnect Tech. Conf. 230-232, June (2006).

[18] Saito, R.; Dresselhaus, G.; Dresselhaus, M.S.; Physical Properties of Carbon Nanotubes; Imperial College Press, (1998).

[19] Sansiri Haruehanroengra and Wei Wang*, Electron Device Letters, IEEE, Volume 28, Issue 8, 756 – 759, Aug. (2007).

[20] Wei Wang, Sansiri Haruehanroengra, Liwei Shang, and Ming Liu as, Inductance of Mixed Carbon Nanotube Bundles.