A Design of 3D EMC Scanning System

Article Preview

Abstract:

3D Electro Magnetic Compatibility (EMC) Scanning system is based on a spectrum analyzer as the core, can provide the relevant parameters of the EMC quickly and accurately, and can be a single component, PCB, machine, cable-round three-dimensional test. Through the host computer, it can realize the visualization of electromagnetic radiation to show real state of electromagnetic radiation.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

1031-1034

Citation:

Online since:

August 2013

Keywords:

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2013 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] Jinliang He, EMC Technology Development of China, IEEE International Symposium on Digital Object Identifier, pp.132-136, (2009).

Google Scholar

[2] E. Sicard, A. Boyer, Enhancing Engineers Skills in EMC of Integrated Circuits, EMC Compo 2011 - 8th Workshop on Electromagnetic Compatibility of Integrated Circuits, pp.115-118, November (2011).

DOI: 10.1109/emccompo.2019.8919774

Google Scholar

[3] M. Ramdani, and al. The Electromagnetic Compatibility of Integrated Circuits – Past, Present and Future, IEEE Trans. on EMC, vol. 51, no 1, p.78 – 100, February (2009).

DOI: 10.1109/temc.2008.2008907

Google Scholar

[4] C. Hoffmann, P. Russer, A Real-Time Low-Noise Ultra-broadband Time-Domain EMI Measurement System up to 18 GHz, IEEE Transactions on Electromagnetic Compatibility, pg. 882, Nov (2011).

DOI: 10.1109/temc.2011.2158827

Google Scholar

[5] M. Coenen, T. Gierstberg, A. van Roermund, A. de Koning, T. Coenen, Time-Domain Surface Scan Method, Electromagnetic Compatibility (APEMC), 2012 Asia-Pacific Symposium on Digital Object Identifier, pp.193-196, (2012).

DOI: 10.1109/apemc.2012.6237977

Google Scholar

[6] Y. Vives-Gilabert, C. Arcambal, A. Louis, F. de Daran, P. Eudeline, and B. Mazari, Modeling magnetic radiations of electronic circuits using near-field scanning method, IEEE Trans. Electromagn. Compat., vol. 49, no. 2, p.391–400, May (2007).

DOI: 10.1109/temc.2006.890168

Google Scholar