Research on Microelectronic Packaging Position Detection Based on Machine Vision

Abstract:

A microelectronic packaging position detection method based on machine vision is proposed. Analyze the color and shape characteristics of the FC-D30 handle circuit boards, extract the R component. Complex background is removed through using image segmentation technology, this research utilizes image smoothing technology to eliminate the noise after segmentation. And use Sobel operator to do edge detection. The package position is detected by using image feature extraction techniques, and finally the position is located accurately. The experimental results show that, the average detection time of this algorithm is 180 milliseconds, the correct positioning is 99%. Microelectronic packaging position can be located fast and accurately by using machine vision technology, this mothod has a good theoretical and practical value.

• Periodical: Applied Mechanics and Materials (Volume 389)
• Pages: 477-482
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.389.477
• Online since: August 2013
• Authors: Chang You Li, Wen Hua Wang, He Ping Wang, Ming Ming Jia, Jing Yu Shang
• Keywords: Digital Image Processing, Machine Vision, Microelectronic Packaging Position

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