The Characteristics of Fluid Flow and Heat Transfer in Wavy, Dimple and Wavy-Dimple Microchannels

Abstract:

The flow and heat transfer characteristics were numerically studied in wave, dimple and wave-dimple microchannels for thermal managements on the chip of Intel i7-996X with heat flux of 0.56 W/mm².The results show that, in microchannles heat sink, the dimple structure could reduce the flow resistances and the wavy wall could enhance heat transfer. According to the both advantages, two types of microchannel heat sink both with dimples and wavy walls were designed, and the flow and heat transfer characteristics were numerically studied. It is proved that the wave-dimple microchannels heat sink holds the characteristics of enhancing heat transfer with low pressure drop, which implies it has great potential of development and application prospect.

• Periodical: Applied Mechanics and Materials (Volume 394)
• Pages: 173-178
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.394.173
• Online since: September 2013
• Authors: Liang Gong, Bo Wei
• Keywords: Chip Cooling, Dimple Channel, Flow Transfer, Heat Transfer, Numerical Simulation, Wave Channel

References

[1] F.R. Wang, Z.X. Li. Microscale Thermal Science and its Applications in MEMS. Instrument Technique and Senser, 2002, 7: 1-4.

[2] C. Harper. Electronic Packaging and Interconnection Handbook (4th edition). New York: McGraw-Hill Professional, (2004).

[3] R. Ulrich, W. Brown. Advanced Electronic Packaging (2nd edition) . New York: Wiley, (2006).

[4] H.Y. Wu, P. Cheng. An experimental study of corrvective heat transfer in silicon micro channels with different surface conditions. Int. J. Heat Mass. Transfer 2003, 46: 2547-2556.

DOI: 10.1016/s0017-9310(03)00035-8

[5] T. Y. Lin, G. S. Kandlikar. A Theoretical Model for Axial Heat Conduction Effects During Single-Phase Flow in Microchannels. Journal of Heat Transfer. 2012, 134: 1-6.

DOI: 10.1115/1.4004936

[6] K. Aziz, J. Rahim. Heat transfer and pressure drop experiments on CMOS compatible microchannel heat sinks for monolithic chip cooling applications. International Journal of Thermal Sciences, 2012, 56: 77-85.

DOI: 10.1016/j.ijthermalsci.2012.01.006

[7] G. Hetsroni, A. Mosyak, E. Pogrebnyak, et al. Heat transfer in micro-channels: comparison of experiments with theory and Numerical results. International Journal of Heat and Mass Transfer, 2005, 48: 5580–5601.

DOI: 10.1016/j.ijheatmasstransfer.2005.05.041

[8] M.R. Salimpour, M. Sharifhasan Constructal, E. Shirani. Optimization of the geometry of an array of micro-channels. International Communications in Heat and Mass Transfer, 2011, 38: 93–99.

DOI: 10.1016/j.icheatmasstransfer.2010.10.008

[9] Y. L. Liu, X. B. Luo. Experimental research on a honeycomb microchannel cooling system. IEEE Components, Packaging And Manufacturing Technology, 2011, 1(9): 1378-1386.

DOI: 10.1109/tcpmt.2011.2162331

[10] G. B. Zhou, S. C. Yao. Effect of surface roughness on laminar liquid flow in micro-channels. Applied Thermal Engineering, 2011, 31: 228-234.

DOI: 10.1016/j.applthermaleng.2010.09.002

[11] C. Jundika, P.K. Agus, S.M.S. Arun. Numerical investigation of laminar heat transfer performance of various coolingchannel designs. Applied Thermal Engineering. 2011, 31: 1293-1304.

DOI: 10.1016/j.applthermaleng.2010.12.036

[12] L. Gong, K. Kota, W.Q. Tao, Y. Joshi. Thermal Performance of Flow and Heat Transfer in Wavy Channels. ASME Journal of Heat Transfer, 2011, 133(5), 051702(1-10).

DOI: 10.1115/1.4003284