Study on the Curing Reaction and Rheological Behavior of Bismaleimide Resin

Qiu Ju Sun; Kun Yuan Wang; Shi Wei Wu; Li Dai

doi:10.4028/www.scientific.net/AMM.395-396.407

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 395-396Study on the Curing Reaction and Rheological...

Study on the Curing Reaction and Rheological Behavior of Bismaleimide Resin

Abstract:

The curing reaction of the bismaleimide resin system was analyzed by FT-IR spectroscopy and differential scanning calorimetry, and the curing reaction kinetics parameters were characterized. Otherwise the rheological behavior of the bismaleimide resin was studied through tracking the changes of the resin viscosity with reaction temperature and time by using a rotatory viscometer. The rheologic dynamic equation and dynamic index of the resin were also established under the condition of constant temperature.The result showed that the bismaleimide resin system was a typical thermosetting resin. This research will help to optimize the molding process parameters of the bismaleimide resin.

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Periodical:

Applied Mechanics and Materials (Volumes 395-396)

Pages:

407-410

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.395-396.407

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Online since:

September 2013

Authors:

Qiu Ju Sun*, Kun Yuan Wang, Shi Wei Wu, Li Dai

Keywords:

Bismaleimide Resin, Curing Reaction, Reaction Kinetics, Rheological Behavior

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