Studies on Mechanical and Thermal Properties of Epoxy Resin Modified by Fluorine-Containing Silicone

Cheng Fang; Dong Bo Guan; Wei Guo Yao; Shou Jun Wang; Hui An

doi:10.4028/www.scientific.net/AMM.401-403.713

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 401-403Studies on Mechanical and Thermal Properties of...

Studies on Mechanical and Thermal Properties of Epoxy Resin Modified by Fluorine-Containing Silicone

Abstract:

The epoxy resin was modified with the mixture of α,ω-dihydroxy poly-(3,3,3-trifluoropropyl) siloxane (PTFPMS), KH560 and stannous octoate. KH560 can react with PTFPMS and also epoxy resin curing agent. The two reactions were characterized by FI-IR. The modified epoxy resin was characterized by FI-IR. The result showed that fluorine-containing silicone had been successfully introduced into the epoxy system. The mechanical and thermal properties of the modified epoxy resin were analyzed. The results showed that with the increase of PTFPMS the impact strength of epoxy resin increased, hardness and bending strength correspondingly reduced, slight decrease in the glass transition temperature.

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Periodical:

Applied Mechanics and Materials (Volumes 401-403)

Pages:

713-716

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.401-403.713

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Online since:

September 2013

Authors:

Cheng Fang, Dong Bo Guan, Wei Guo Yao, Shou Jun Wang, Hui An

Keywords:

Epoxy Resin (ER), Fluorine-Containing Silicone, Mechanical Property

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