Research on Crack Mechanism of Surface/Subsurface Based on Grinding Stress Field in Ultrasonic Grinding Nano-Ceramics

Abstract:

The crack nucleation and propagation process in ultrasonic grinding engineering ceramics are studied based on indentation fracture mechanics. The study shows ultrasonic grinding can be considered as continuous loading and unloading process in view of a single grain. The loading makes cracks form and preliminarily propagate; while the unloading makes them propagate further and makes the direction of crack propagation offset to the workpiece surface, not so far as to extend to the material interior. In common grinding cracks have extended to the material interior, resulting in deep subsurface crack in the subsurface layers. In this paper, the ground surface of small crack damage can be obtained with large grinding depth in ultrasonic grinding compared with common grinding under the same conditions.

• Periodical: Applied Mechanics and Materials (Volume 42)
• Pages: 444-448
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.42.444
• Online since: November 2010
• Authors: Chong Yang Zhao, Xiang Dong Li, Feng Jiao
• Keywords: Nano Ceramic, Subsurface Damage, Surface Crack Damage, Ultrasonic Grinding

References

[1] X. L. Tian: Engineering Ceramics processing theory and technology(National Defense Industry Press, Beijing 2006).

[2] B. M. Li, B. Zhao: Abrasives and Grinding (Chemistry Industry Press, Beijing 2009).

[3] B. M. Li, B. Zhao: Modern Grinding Technology (Mechanical Industry Press, Beijing 2005).

[4] J. H. Gong: Fracture Mechanics of Ceramic Material(Tsinghua University Press, Beijing 2001).

[5] C. H. Deng, B. Zhang : The Journal of Hunan University Vol 29/5(2002), p.61.

[6] R. Hoyle: Developments in micro and nano engineering and manufacturing(Polymer Process Engineering Conference, 2007).

[7] G. Cao, Y. Namba: Key Engineering Materials Vol 381-382(2008), p.105.

[8] F. Jiao, B. Zhao: Key Engineering Materials Vol 375-376(2008), p.263.

[9] B. Zhao, X. H. Zhang, C. S. Liu: Key Engineering Materials Vol 291-292 (2005), p.45.

[10] Y. Yan, B. Zhao: Materials Science Forum Vol 532-533, (2006), p.532.

[11] Y. Wu: Experimental study on the grinding mechanism of Nano-ceramic under two-dimensional ultrasonic vibration assisted(Shanghai Jiao Tong university, Shanghai, 2006).

[12] B. Zhao: Key Engineering Materials, 2010, (accepted).