Design of High Power RGB White Light Emitting Diodes

Abstract:

In this paper, thermal performance of RGB white LED packages was optimized by thermal simulation using the Finite Volume method. A Monte Carlo photon simulation method was utilized for the analysis of optical performance of LED in quantitative terms. It was found that the distribution of RGB chips has great effect both on the thermal and optical performance of the RGB white LEDs. The tilted angle, material of the reflection cup, and the shape of encapsulant were found to be the key factors which determine the extraction efficiency of LED package. It is demonstrated that the combination of optical and thermal simulation provides a comprehensive optimization approach for a design of high efficient RGB white LED package.

• Periodical: Applied Mechanics and Materials (Volumes 423-426)
• Pages: 2645-2650
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.423-426.2645
• Online since: September 2013
• Authors: Wei Chen*, Lang Wang, Lian Qiao Yang, Jian Hua Zhang
• Keywords: Extraction Efficiency, RGB White LED, Thermal Performance, Uniformity of Color Distribution

References

[1] J.U. Kim, Y.S. Kim and H.S. Yang: Nanocrystalline Y3Al5O12: Ce phosphor-based white light-emitting diodes embedded with CdS: Mn/ZnS core/shell quantum dots, Mater. Lett. 63, 614 (2008).

DOI: 10.1016/j.matlet.2008.12.001

[2] J. Park, M.W. Shin, and C.C. Lee: Thermal Modeling and Measurement of GaN-based HFET Devices, IEEE Elec. Dev. Lett. 24, 424 (2003).

DOI: 10.1109/led.2003.814020

[3] L.Q. Yang, J. ZH. Hu, S.H. Jang, and M.W. Shin: Thermal design of ceramic packages for high power light-emitting diodes, Semicond. Sci. Technol 22, 705 (2007).

DOI: 10.1088/0268-1242/22/7/005

[4] L.Q. Yang, J. ZH. Hu, S. H. Jang, and M.W. Shin: Dynamic Thermal Analysis of High-Power LEDs at Pulse Conditions, IEEE Elec. Dev. Lett. 29, 863 (2008).

DOI: 10.1109/led.2008.2000953

[5] T.X. Lee, K.F. Gao, W.T. Chien, and C.C. Sun: Light Extraction Analysis for GaN-based LEDs with Pyramid Array, Opt. Exp. 15, 6670 (2007).

[6] N.T. Tran and F.G. Shi: LED package design for high optical efficiency and low viewing angle, IEEE Microsystems, Packaging, Assembly and Circuits Technology, International Volume 1-3, 10 (2007).

DOI: 10.1109/impact.2007.4433557

[7] S.J. Lee: Analysis of light-emitting diodes by Monte Carlo photon simulation, Appl. Opt. 40, 1427 (2001).

DOI: 10.1364/ao.40.001427

[8] Y.S. Ohno: Spectral Design Considerations for White LED Color Rendering, Optical Engineering 44, 111302 (2005).

DOI: 10.1117/1.2130694

[9] C.C. Sun, T.X. Lee, S.H. Ma, Y.L. Lee, S. M Huang: Precise optical modeling for LED lighting verified by cross correlation in the midfield region, Opt. Lett. 31, 2193-2195 (2006).

DOI: 10.1364/ol.31.002193

[10] Farkas G, van Voorst Vader Q, Poppe A and Bogn´ar : IEEE Trans. Compon. Packag. Technol. 28, 45 (2005).

[11] C.J.M. Lasance, C.T. Murray, D.L. Saums, and M. Rencz: Challenges in Thermal Interface Material Testing, in Proceedings of 22nd IEEE SEMI-THERM Symposium (Dallas, TX) Mar. 14-16, (2006), p.42.

DOI: 10.1109/stherm.2006.1625204

[12] L. Kim and M.W. Shin: Implementation of Side Effects in Thermal Characterization of RGB Full-Color LEDs, IEEE Elec. Dev. Lett. 28, 578 (2007).

DOI: 10.1109/led.2007.899327