Heat Generation Characteristics and Heat Dissipation Experiment of CPU Chip

Mao De Li; Shuai Wei

doi:10.4028/www.scientific.net/AMM.437.1057

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 437Heat Generation Characteristics and Heat...

Heat Generation Characteristics and Heat Dissipation Experiment of CPU Chip

Abstract:

With the development of the CPU integration, providing effective heat removal solutions for chip is an important research. This article analyses the reason of chip overheat and different adopted techniques in chip heat dissipation and commits itself to take the variation of the operating conditions into account to obtain the overall temperature rising curve based on a simplified thermal model. And then it utilizes heating plate as constant heat source to simulate CPU heating. Under the power of 20W, 30W and 40W, we compare five kinds of fan-cooled radiators in order to provide the experimental statistics for the further design and theoretical analysis.

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Periodical:

Applied Mechanics and Materials (Volume 437)

Pages:

1057-1061

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.437.1057

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Online since:

October 2013

Authors:

Mao De Li*, Shuai Wei

Keywords:

CPU, Fan-Cooled Radiator, Heat Dissipation

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* - Corresponding Author

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