Transient Heat Transfer Analysis of a Micro Heat Exchanger

Abstract:

The research object is a micro heat exchanger (MHT) applied in chip cooling, a three dimensional simulation model is developed to analyze the transient heat transfer of the exchanger according to both exponential and periodic heat fluxes. Based on the computational results of the profiles of temperature and thermal stress, a comparison of performance of heat exchangers made of copper and silicon nitride compound is carried out. The results indicate that the capability of a copper heat exchanger is better than that of a silicon nitride exchanger under low load working condition due to the excellent thermal conductivity of copper. However, with large load fluctuations, the advantage of structure strength of compound makes the exchanger attractive since it has lower thermal stress and could guarantee a long-term stability. The efforts of this paper are referable for further research and development of micro heat exchangers.

• Periodical: Applied Mechanics and Materials (Volume 455)
• Pages: 330-334
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.455.330
• Online since: November 2013
• Authors: Zhong Qian*, Hai Min Wang
• Keywords: MHT, Temperature Field, Thermal Stress, Transient Heat Transfer

References

[1] W.D. Wang, J.Y. Jia, and M.M. Li: Micronanoelectronic Technology No. 5 (2005), p.227.

[2] N.G. Hernando, A.A. Iborra, U.R. Rivas, and M. Izquierdo: International Journal of Heat and Mass Transfer Vol. 52 (2009), p.5433.

[3] E. Galvis, B.A. Jubran, and F. Xi: Heat Mass Transfer Vol. 44 (2008), p.659.

[4] K. Foli, T. Okabe, M. Olhofer, Y. Jin, and B. Sendhoff: International Journal of Heat and Mass Transfer Vol. 49 (2006), p.1090.

DOI: 10.1016/j.ijheatmasstransfer.2005.08.032

[5] J. Li, S.F. Wang, W. Cai, W.J. Zhang: Applied Thermal Engineering Vol. 30 (2010), p.2738.

[6] J.M. Koo, S.J. Im, L.N. Jiang, and K.E. Goodson: Journal of Heat Transfer Vol. 127 (2005), p.49.

[7] B. Alm, U. Imke, R. Knitter, U. Schygulla, and Zimmermann: Chemical Engineering Journal Vol. 135S (2008), p. S179.

DOI: 10.1016/j.cej.2007.07.005

[8] P.S. Lee, and S.V. Garimella: International Journal of Heat and Mass Transfer Vol. 49 (2006), p.3060.

[9] G.L. Morini: International Journal of Heat and Mass Transfer Vol. 43 (2000), p.741.

[10] V.V. Dharaiya, and S.G. Kandlikar: Journal of Heat Transfer Vol. 134 (2012), No. 020911.

[11] R.K. Shah, and A.L. London: Journal of Fluids Engineering Vol. 102 (1980), p.256.

[12] K.R. Perkins, K.W. Shade, and D.M. McEligot: Int. J. Heat and Mass Transfer Vol. 16 (1973), p.897.

[13] H.S. Li, and C. Mei: J. Cent. South Univ. Technol. Vol. 12 (2005), p.709.

[14] F. Picard, D. Averous, X. Joulia, and D. Barreteau: 16th European Symposium on Computer Aided Process Engineering (2006), p.659.

DOI: 10.1016/s1570-7946(06)80120-3

[15] A.V. Chichindaev: KORUS'05 (2005), p.418.