Thermal Analysis and Optimization of High Power LED Automotive Headlamp Cooling Device

Abstract:

High power LED headlamp cannot operate normally and efficiently in case the maximum junction temperature exceeds 120°C. Therefore, it is essential to install external cooling device with excellent thermal management. A model based on plate-fin heat sink is presented, the heat transfer plates (HTPS) are added to bridge aluminum substrate and heat sink. And its thermal performance is evaluated compared with the one only installing heat sink. Results reveal the HTPS coupled with heat sink has a good cooling performance. In addition, the correlation between the junction temperature and the HTPS length is investigated. The optimum length is 47 mm. Furthermore, considerable simulation and experiment are conducted on the junction temperature variation subject to input power, ambient temperature, as well as the installation angle respectively. Finally, a fan is added based on the original device to enhance cooling. It indicates that the junction temperature decreases gradually with the presence of velocity air flow.

• Periodical: Applied Mechanics and Materials (Volumes 457-458)
• Pages: 399-404
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.457-458.399
• Online since: October 2013
• Authors: Xin Jie Zhao, Yi Xi Cai, Jing Wang, Xiao Hua Li, Chun Zhang
• Keywords: Cooling Performance, Enhanced Cooling, Junction Temperature, LED Headlamp

References

[1] Adam, C. & Samuel, G. 2009. Thermal effects in packaging high-power light emitting diode arrays. Applied Thermal Engineering 29：364-371.

DOI: 10.1016/j.applthermaleng.2008.03.019

[2] Arik, M. & Petroski J. & Weaver S. 2002. Thermal challenges in the future generation solid state lighting applications: Light emitting diodes. Proc. IEEE Intersociety Conf. Thermal Phenomena awaii, a: 113-120.

DOI: 10.1109/itherm.2002.1012446

[3] Bladimir, et al. 2013. Comparison and optimization of single-phase liquid cooling devices for the heat dissipation of high-power LED arrays. Applied Thermal Engineering 59: 648-659.

DOI: 10.1016/j.applthermaleng.2013.06.036

[4] Jung-Chang Wang. 2011. Thermal investigations on LED vapor chamber-based plate. International Communications in Heat and Heat and Mass Transfer 38: 1206-1212.

DOI: 10.1016/j.icheatmasstransfer.2011.07.002

[5] Kyu Hyung Do. & Tae Hoon Kim, et al. 2012. General correlation of a natural convective heat sink with plate-fins for high concentrating photovoltaic module cooling. Solar Energy 86: 2725-2734.

DOI: 10.1016/j.solener.2012.06.010

[6] Minseok Ha, et al. 2012 Development of a thermal resistance model for chip-on-board packaging of high power LED arrays. Microelectronics Reliability 52 : 836-844.

DOI: 10.1016/j.microrel.2012.02.005

[7] Narendran, N. & Gu, Y.M. 2005. Life of LED-based white light sources. Journal of Display Technology 1 (1): 167–171.

DOI: 10.1109/jdt.2005.852510

[8] Ren-Tsung Huang, et al. 2008. Orientation effect on natural convective performance of square pin fin heat sinks. Int. J. Heat Mass Transfer 51: 2368-2376.

DOI: 10.1016/j.ijheatmasstransfer.2007.08.014

[9] Seung-Hwan Yu, et al. 2011. Optimum design of a radial heat sink under nature convection. Int. J. Heat Mass Transfer 54: 2499-2505.

DOI: 10.1016/j.ijheatmasstransfer.2011.02.012

[10] Tsai MY & Chen CH & Kang CS. 2011. Thermal measurements and analyses of low-cost high-power LED packages and their modules. Microelectron Reliab.

DOI: 10.1016/j.microrel.2011.04.008

[11] Yan Lai, et al. 2009. Liquid cooling of bright LEDs for automotive applications. Applied Thermal Engineering 29: 1239-1244.

DOI: 10.1016/j.applthermaleng.2008.06.023