Coefficient of Performance of Thermoelectric Cooling on Nanofluids

Abstract:

This paper reports on experimental comparisons of coefficient of performance (COP) of a thermoelectric coolingsystem which cooled the hot side of the TEC by water (wc), ethylene glycol (egc) and nanofluids (nfc) The nanofluids is composed of ethylene glycol with silver nano(35 nm).The TEC was composed of the TE cooling modules, heat exchanger, and the air cooled heat sink at the cold side of the TE modules.Experiments were conducted with various current input 1 - 4.5 A to find out the optimum current input condition. To consideration of cooling capacity and COP of system was measured the hot and cold side temperature of TEC. Results shown that, the cooling capacity was increased with current input. The maximum cooling capacity of nfc, egc and wc are about 72, 62 and 41 W, respectively. Considered with highest COP found that the optimum current input is approximately 2.5 A. The maximum COP of nfc, egc and wc are about 2.01, 1.7 and 1.12, respectively. Therefore, the proposed TEC-nfc concept is expected to contribute to wider applications of the TE cooling system.

• Periodical: Applied Mechanics and Materials (Volume 459)
• Pages: 91-99
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.459.91
• Online since: October 2013
• Authors: Somchai Maneewan*, Atthakorn Thongtha, Chantana Punlek
• Keywords: Coefficient of Performance, Cooling Capacity, Nanofluid, Thermoelectric

References

[1] M. Felli: Ashrea Trans. Vol. 89(1A) (1983), p.189.

[2] S.B. Riffat and G.Q. Qiu: Appl. Thermal Eng. Vol. 24 (2004), p. (1979).

[3] S.B. Riffat, S.A. Omer and X.L. Ma: Renewable Energy Vol. 23 (2001), p.313.

[4] K.H. Lee and O.J. Kim: Inter. J. Heat Mass Transfer Vol. 50 (2007), p. (1982).

[5] R. Yang, G. Chen, A.R. Kumar, G.J. Snyder and J.P. Fleurial, Energy Convers. Manage. Vol. 46 (2005), p.1407.

[6] D.M. Rowe: CRC Handbook of Thermoelectric (CRC Press, London 1996).

[7] K.W. Lindler: Energy Convers Manage. Vol. 39(10) (1998), p.1009.

[8] S.B. Riffat and X. Ma: Appl. Thermal Eng. Vol. 23 (2000), p.913.

[9] Z. Wen and C.K. Fah, The optimum thermal design of microchannel heat sinks, in: 1997 IEEE/CPMT Electronic Packaging Technology Conference, 1997, 123–129.

DOI: 10.1109/eptc.1997.723898

[10] I. Mudawar: IEEE Trans. Compon. Pack. Manuf. Technol. Vol. 24 (2001), p.122.

[11] C.H. Amon, J. Murthy, S.C. Yao, S. Narumanchi, C.F. Wu and C.C. Hsieh: Exp. Therm. Fluid Sci. Vol. 25 (2001), p.231.

[12] P. Naphon and S. Wiriyasart: Inter. Commun. Heat Mass Trans. Vol. 36 (2009), p.166.

[13] R. Chein and J. Chuang: Inter. J. Thermal Sci. Vol. 46 (2007), p.57.

[14] A.G. AgwuNnanna, W. Rutherford, W. Elomar and B. Sankowski: Appl. Thermal Eng. Vol. 29 (2009), p.491.

[15] R. Chein and G. Huang: Appl. Thermal Eng. Vol. 24 (2004), p.2207.

[16] R. Chein and Y. Chen: Inter. J. Refrig. Vol. 28 (2005), p.828.

[17] Y.W. Chang, C.C. Chang, M.T. Ke and S.L. Chen: Appl. Thermal Eng. Vol. 29 (2009), p.2731.

[18] J.L. Yu and B.M. Wang: Inter. J. Refrig. Vol. 32 (2009), p.32.

[19] R.E. Simmons and R.C. Chu: Application of thermoelectric cooling to electronic equipment: a review and analysis, in: 16th IEEE SEMI-THERM Symposium, 2000, 1–8.

[20] P. Phelan, V. Chiriac, T.Y. Lee: Current and future miniature refrigeration cooling technologies for high power microelectronics, in: 17th IEEE SEMITHERM Symposium, 2001, 158–167.

DOI: 10.1109/stherm.2001.915172

[21] J.P. Holman: Thermodynamics (McGraw Hill, New York 1980).

[22] A.G.A. Nnanna: J. Heat Transfer (2007). June issue.

[23] P. Keblinski, S.R. Phillpot, S.U.S. Choi amd J.A. Eastman: Inter. J. Heat Mass Transfer Vol. 45 (2002), p.855.

[24] X. Wang, X. Xu and S.U.S. Choi, J. Thermophys. Heat Transfer Vol. 13(4) (1999), p.474.

[25] Q.Z. Xue: Phys. Lett. A Vol. 307 (2003), p.313.

[26] S. Maneewan and S. Chindaruksa: J. Electro. Mater. Vol. 38(7) (2009).