Multilayer of Ni/Cu Coating Produced via Electroplating Process

S.S. Jikan; S.S. Abdullah; M.H. Ismail; N.A. Ismail; Nur Azam Badarulzaman

doi:10.4028/www.scientific.net/AMM.465-466.891

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 465-466Multilayer of Ni/Cu Coating Produced via...

Multilayer of Ni/Cu Coating Produced via Electroplating Process

Abstract:

Nickel (Ni)/ Copper (Cu) multilayer were deposited on Cu substrate by electroplating process using dual bath technique. Individual sample of multilayer with sublayer thicknesses of 1 μm, 5 μm, 10 μm and 50 μm have been produced. The structure of the multilayer was characterized by X-Ray Diffraction and Scanning Electron Microscopy whereas one of the mechanical properties of the samples was investigated by means of Vickers Hardness. The results showed that the surface hardness of the coated Cu substrate increases if compared to that of pure Cu substrate. Additionally, these values increased when sublayer thickness of samples were decreased.

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Periodical:

Applied Mechanics and Materials (Volumes 465-466)

Pages:

891-895

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.465-466.891

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Online since:

December 2013

Authors:

S.S. Jikan, S.S. Abdullah, M.H. Ismail, N.A. Ismail, Nur Azam Badarulzaman

Keywords:

Cu/Ni, Electroplating, Multilayer, Vickers Hardness

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